EP3SL70F780I4N

The EP3SL70F780I4N is a Stratix® III L field programmable gate array (FPGA) in a 780-ball BGA surface-mount package. It provides 67,500 logic elements and approximately 2.70 Mbits of embedded memory, along with 488 I/O pins and an operating voltage range of 0.86 V to 1.15 V.

With an industrial operating temperature range from −40 °C to 100 °C and RoHS compliance, this device is intended for designs that require substantial on-chip logic capacity, integrated RAM, and a high pin count in a compact FCBGA footprint.

Key Features

• Core Logic 67,500 logic elements provide large-scale programmable logic capacity for complex digital functions and implementation of custom logic architectures.
• Embedded Memory Approximately 2.70 Mbits of on-chip RAM supports buffering, state storage, and data-path implementations without requiring external memory for many designs.
• I/O Density 488 I/O pins deliver extensive external connectivity for parallel buses, interfaces, and multi-channel signaling.
• Power Core supply operation across 0.86 V to 1.15 V enables compatibility with designs targeting low-voltage core domains.
• Package & Mounting 780-BBGA (FCBGA) package with a 29 × 29 mm footprint (780-FBGA) supports surface-mount assembly and high interconnect density in a compact form.
• Temperature & Grade Industrial-grade device rated for −40 °C to 100 °C operation, suitable for temperature-variable environments.
• Regulatory RoHS compliant for systems requiring lead-free components.

Typical Applications

• High-density digital systems — Use the large logic element count and embedded RAM to implement complex state machines, data-path processing, and custom accelerators within a single device.
• Multi-channel I/O designs — 488 I/O pins enable integration of multiple parallel interfaces, sensors, or control channels without extensive external multiplexing.
• Embedded system integration — Combine logic, memory, and I/O in the FCBGA package to consolidate functions and reduce board-level component count.

Unique Advantages

• Substantial programmable logic: 67,500 logic elements allow designers to implement large, integrated digital functions without splitting logic across multiple devices.
• On-chip memory capacity: Approximately 2.70 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs, simplifying board design.
• High I/O count: 488 I/O pins provide flexible connectivity options for complex interfacing and parallel signal routing.
• Compact, manufacturable package: 780-BBGA FCBGA (29 × 29 mm) supports surface-mount assembly while delivering high interconnect density for space-constrained designs.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in thermally variable environments.
• RoHS compliant: Meets lead-free component requirements for regulated assemblies.

Why Choose EP3SL70F780I4N?

The EP3SL70F780I4N positions itself as a high-capacity, industrial-grade FPGA option for designs that require extensive programmable logic, significant embedded memory, and broad I/O connectivity in a compact FCBGA package. Its defined core voltage range and RoHS compliance make it straightforward to integrate into controlled power domains and lead-free assembly processes.

This device is a practical choice for engineers seeking to consolidate complex digital functions, reduce board-level component count, and maintain robust operation across a wide temperature range while benefiting from the scalability and reconfigurability inherent in FPGA-based designs.

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