EP4CE10E22C6

The EP4CE10E22C6 is a Cyclone® IV Field Programmable Gate Array (FPGA) device providing reconfigurable logic and on-chip memory in a compact surface-mount package. The device combines 10,320 logic elements with approximately 0.424 Mbits of embedded memory and 91 user I/O pins to support medium-complexity programmable logic functions.

Designed for commercial-temperature applications, the device operates from a 1.15 V to 1.25 V core supply and is delivered in a 144-pin LQFP exposed-pad package suitable for board-level integration where thermal dissipation and a small PCB footprint are important.

Key Features

• Logic Capacity — 10,320 logic elements to implement custom logic, glue logic, and state machines for mid-range designs.
• Embedded Memory — Approximately 0.424 Mbits of on-chip RAM for buffering, small FIFOs, and lookup tables.
• I/O — 91 user I/O pins to interface with peripherals, sensors, and other digital subsystems.
• Core Voltage — Low-voltage core operation from 1.15 V to 1.25 V to match system power architectures.
• Package & Mounting — 144-LQFP exposed pad (supplier package: 144-EQFP 20×20) in a surface-mount form factor with an exposed pad to aid PCB thermal transfer.
• Operating Temperature — Commercial grade operation from 0 °C to 85 °C for typical ambient environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Custom control and glue logic — Implement board-level control, protocol translation, and finite-state machines using the device's 10,320 logic elements and 91 I/Os.
• Embedded buffering and small data paths — Use the approximately 0.424 Mbits of on-chip RAM for small FIFOs, buffering, and temporary data storage.
• Prototyping and development — Deploy in evaluation and prototype systems that require reconfigurable logic in a compact 144-LQFP package.

Unique Advantages

• Balanced logic and memory — The combination of 10,320 logic elements and approximately 0.424 Mbits of embedded RAM supports a wide range of mid-complexity digital functions without large external memory needs.
• Compact surface-mount package with thermal pad — The 144-LQFP exposed pad package facilitates integration on space-conscious PCBs while improving thermal dissipation.
• Flexible I/O count — Ninety-one user I/Os allow direct interfacing with multiple peripherals and system buses.
• Low-voltage core — 1.15 V to 1.25 V supply compatibility helps align with modern low-voltage system rails.
• Commercial temperature rating — Rated for 0 °C to 85 °C operation for deployments in standard commercial environments.
• RoHS compliant — Meets environmental compliance requirements for restricted substances.

Why Choose EP4CE10E22C6?

The EP4CE10E22C6 delivers a practical balance of logic capacity, embedded memory, and I/O density in a compact, surface-mount 144-LQFP exposed-pad package. Its specifications make it well suited to designers who need reconfigurable logic for mid-complexity tasks while maintaining a small PCB footprint and attention to thermal management.

With defined operating voltage and temperature ranges and RoHS compliance, this device offers a predictable integration path for commercial-grade embedded systems, prototypes, and control applications that require programmable logic and on-chip RAM in a single component.

Request a quote or submit a procurement inquiry to obtain pricing, lead time, and availability for the EP4CE10E22C6.