EP4CE10E22C7N
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 91 423936 10320 144-LQFP Exposed Pad |
|---|---|
| Quantity | 593 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-EQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP Exposed Pad | Number of I/O | 91 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 645 | Number of Logic Elements/Cells | 10320 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 423936 |
Overview of EP4CE10E22C7N – Cyclone® IV E Field Programmable Gate Array (FPGA) IC 91 423936 10320 144-LQFP Exposed Pad
The EP4CE10E22C7N is a Cyclone® IV E field programmable gate array in a 144-LQFP exposed-pad surface-mount package. It provides programmable logic, embedded RAM and a flexible set of I/O for commercial-grade embedded designs.
With 10,320 logic elements, approximately 0.424 Mbits of on-chip RAM and 91 I/O pins, this device targets commercial applications that require mid-range programmable logic capacity in a compact 20 × 20 mm package.
Key Features
- Core Logic 10,320 logic elements suitable for mid-density programmable logic designs.
- Embedded Memory 423,936 bits of on-chip RAM (approximately 0.424 Mbits) to support data buffering, FIFOs and small local memory structures.
- I/O Density 91 user I/O pins for external interfacing and signal routing in compact systems.
- Power and Voltage Core supply operating range from 1.15 V to 1.25 V to match system power rails and core power planning.
- Package and Mounting 144-LQFP exposed pad (supplier package: 144-EQFP, 20 × 20 mm) in a surface-mount form factor for PCB assembly and thermal coupling via the exposed pad.
- Operating Range Commercial temperature grade with an operating range of 0 °C to 85 °C for standard commercial environments.
- Compliance RoHS compliant to meet common environmental and manufacturing requirements.
Typical Applications
- Commercial Embedded Systems Programmable logic integration for controllers, protocol bridging and custom logic blocks in commercial electronics.
- Prototyping and Development Mid-range FPGA capacity for hardware prototyping, algorithm validation and design iteration.
- I/O Expansion and Glue Logic Use as a flexible interface layer to aggregate signals, implement timing logic and manage peripheral interfaces.
Unique Advantages
- Balanced Logic Capacity: 10,320 logic elements provide ample resources for mid-range designs without the footprint of larger devices.
- On-Chip Memory: Approximately 0.424 Mbits of embedded RAM reduces reliance on external memory for buffering and local data storage.
- Compact, Assembly-Friendly Package: 144-LQFP with exposed pad offers a compact 20 × 20 mm footprint and supports thermal dissipation through the pad.
- Clear Power Envelope: Narrow core voltage range (1.15–1.25 V) simplifies core power supply design and decoupling strategies.
- Commercial Temperature Rating: Specified 0 °C to 85 °C operating range aligns with standard commercial deployments.
- RoHS Compliant: Meets common environmental manufacturing requirements to simplify regulatory handling.
Why Choose EP4CE10E22C7N?
The EP4CE10E22C7N positions itself as a practical mid-density Cyclone IV E FPGA option for commercial embedded projects that require a balance of programmable logic, embedded RAM and a healthy complement of I/O within a compact LQFP package. Its defined core voltage range and exposed-pad package simplify power and thermal design considerations for PCB-level integration.
This device is well suited to engineers and teams building commercial electronics that demand flexible logic resources with on-chip memory, while maintaining a compact board footprint and standard operating-temperature range. The Cyclone IV family documentation provides further device-level operating conditions and electrical characteristics to support design and qualification activities.
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