EP4CE10E22C8

IC FPGA 91 I/O 144EQFP
Part Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 91 423936 10320 144-LQFP Exposed Pad

Quantity 646 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-EQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFP Exposed PadNumber of I/O91Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs645Number of Logic Elements/Cells10320
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits423936

Overview of EP4CE10E22C8 – Cyclone® IV E Field Programmable Gate Array (FPGA) IC 91 423936 10320 144-LQFP Exposed Pad

The EP4CE10E22C8 is a Cyclone IV E Field Programmable Gate Array (FPGA) offering a balanced mix of programmable logic, embedded memory, and I/O capacity in a compact surface-mount package. Built for commercial-grade applications, this device integrates 10,320 logic elements, approximately 0.424 Mbits of embedded RAM, and 91 user I/O to support a wide range of mid-density digital designs.

Supplied in a 144-LQFP exposed pad package (supplier designation 144‑EQFP, 20×20), the device operates from a core voltage range of 1.15 V to 1.25 V and across a commercial temperature range of 0 °C to 85 °C. Detailed device characteristics, operating conditions, and electrical specifications are documented in the Cyclone IV device handbook and accompanying datasheet.

Key Features

  • Core Logic — 10,320 logic elements provide mid-range programmable logic capacity suitable for custom digital functions and integration of control logic.
  • Embedded Memory — Approximately 0.424 Mbits of on-chip RAM for small buffers, FIFOs, and local data storage to support deterministic data handling.
  • I/O Resources — 91 user I/O pins enable flexible interfacing with peripherals, sensors, and external devices.
  • Power and Supply — Core supply range of 1.15 V to 1.25 V to match system power-rail designs and manage core power consumption.
  • Package and Mounting — 144-LQFP with exposed pad (supplier package 144‑EQFP, 20×20) in a surface-mount form factor for compact PCB layouts and thermal anchoring via the exposed pad.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for typical commercial electronics deployments.
  • Regulatory Compliance — RoHS compliant, enabling use in lead-free assembly processes.
  • Comprehensive Documentation — Datasheet and Cyclone IV device handbook coverage includes operating conditions, absolute maximum ratings, DC characteristics, power consumption, switching characteristics, and system-level guidance.

Typical Applications

  • Custom digital logic — Implement application-specific state machines, glue logic, and protocol adapters using the device’s 10,320 logic elements and 91 I/O.
  • Interface bridging and I/O expansion — Use the available I/O to aggregate and translate signals between subsystems or to expand peripheral connectivity on compact PCBs.
  • Buffering and small data storage — Leverage approximately 0.424 Mbits of embedded RAM for FIFO buffering, temporary storage, and small lookup tables.
  • Compact board-level FPGA deployment — The 144-LQFP exposed pad surface-mount package supports space-constrained designs while providing thermal return through the exposed pad.

Unique Advantages

  • Right-sized logic capacity: 10,320 logic elements provide the integration needed for mid-complexity designs without excess overhead.
  • On-chip memory for deterministic buffering: Approximately 0.424 Mbits of embedded RAM helps reduce external memory dependencies for small data tasks.
  • Generous I/O count: 91 user I/O pins simplify interfacing to multiple peripherals and subsystems without immediate need for external expanders.
  • Compact, manufacturable package: 144-LQFP exposed pad and surface-mount assembly support dense PCB layouts and standard SMT processes.
  • Commercial temperature suitability: Rated 0 °C to 85 °C for deployment in typical commercial electronic products.
  • Documented device-level guidance: Extensive datasheet and Cyclone IV handbook content covers electrical characteristics, operating conditions, and design considerations.

Why Choose EP4CE10E22C8?

The EP4CE10E22C8 Cyclone IV E FPGA delivers a practical blend of programmable logic, embedded RAM, and I/O in a compact surface-mount LQFP package for commercial-grade designs. Its combination of 10,320 logic elements, approximately 0.424 Mbits of on-chip memory, and 91 I/O pins makes it well suited to designers who need mid-range integration and flexible interfacing without moving to higher-capacity device families.

Backed by the Cyclone IV device handbook and detailed datasheet documentation, the EP4CE10E22C8 provides the specification-level detail required for confident integration into production hardware, enabling predictable behavior across the specified voltage and temperature ranges.

Request a quote or submit an inquiry to receive pricing and availability for the EP4CE10E22C8 and to obtain the full datasheet and technical documentation for integration planning.

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