EP4CE10E22C8N
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 91 423936 10320 144-LQFP Exposed Pad |
|---|---|
| Quantity | 695 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-EQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP Exposed Pad | Number of I/O | 91 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 645 | Number of Logic Elements/Cells | 10320 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 423936 |
Overview of EP4CE10E22C8N – Cyclone IV E Field Programmable Gate Array (FPGA) IC, 144-LQFP Exposed Pad
The EP4CE10E22C8N is a Cyclone® IV E Field Programmable Gate Array (FPGA) manufactured by Intel, offered in a 144-LQFP exposed pad package. It provides a moderate-density programmable logic fabric with on-chip embedded memory and a broad set of user I/O suitable for commercial embedded designs and prototype platforms.
Key attributes include 10,320 logic elements, approximately 0.424 Mbits of embedded memory, support for up to 91 I/O, and a low-voltage core supply range of 1.15 V to 1.25 V. The device is RoHS compliant and specified for commercial operating temperatures from 0 °C to 85 °C.
Key Features
- Logic Capacity 10,320 logic elements providing a moderate-density fabric for custom digital logic and control functions.
- Embedded Memory Approximately 0.424 Mbits (423,936 bits) of on-chip RAM for buffering, state storage, and small memory-mapped functions.
- I/O and Connectivity Up to 91 device I/O pins to support multiple peripheral interfaces and board-level signal routing.
- Power and Core Voltage Core supply voltage range of 1.15 V to 1.25 V to match system power budgets and core power domains.
- Package and Mounting 144-LQFP exposed pad package (supplier device package listed as 144-EQFP, 20 × 20) designed for surface-mount assembly with improved thermal contact through the exposed pad.
- Operating Range and Grade Commercial grade operation from 0 °C to 85 °C for general-purpose embedded and application development.
- Compliance RoHS compliant.
- Documentation Coverage The Cyclone IV device handbook and datasheet series include detailed sections on operating conditions, recommended operating conditions, DC characteristics, supply current, ESD performance, switching characteristics and other device-level specifications.
Typical Applications
- Programmable logic and prototyping Implement custom digital functions, algorithm validation, and hardware prototypes using the device's 10,320 logic elements and on-chip RAM.
- I/O expansion and interface bridging Bridge multiple peripheral interfaces and manage board-level signal aggregation with up to 91 user I/O.
- Embedded control and glue logic Replace multiple discrete components with compact programmable logic for control, sequencing, and protocol adaptation in commercial electronics.
- Compact board-level FPGA integration The 144-LQFP exposed pad package supports surface-mount assembly while providing thermal relief for moderate-power, compact designs.
Unique Advantages
- Balanced logic and memory A combination of 10,320 logic elements and ~0.424 Mbits of embedded RAM enables implementation of moderate-complexity designs without external RAM for many use cases.
- Generous I/O count Up to 91 I/O pins allow flexible interfacing to sensors, peripherals, and board-level signals, reducing the need for additional interface ICs.
- Low-voltage core The 1.15 V–1.25 V core supply aligns with modern low-voltage system power domains, supporting integration into contemporary embedded platforms.
- Compact, serviceable package 144-LQFP with exposed pad supports surface-mount manufacturing and improved thermal performance in space-constrained assemblies.
- Commercial temperature suitability Specified for 0 °C to 85 °C operation to match a wide range of commercial and development applications.
- Standards-aware manufacturing RoHS compliance supports environmentally conscious supply-chain and manufacturing requirements.
Why Choose EP4CE10E22C8N?
The EP4CE10E22C8N positions itself as a practical, moderate-density Cyclone IV E FPGA option for engineers and teams needing flexible programmable logic, embedded RAM, and a substantial I/O complement in a compact surface-mount package. Its 10,320 logic elements and approximately 0.424 Mbits of on-chip memory provide a solid foundation for custom digital logic, protocol bridging, and prototype development while the 1.15 V–1.25 V core and 144-LQFP exposed pad package simplify power-domain integration and thermal management.
This device is well suited to development groups, OEMs, and engineering teams building commercial-grade embedded systems that require reconfigurable logic, moderate on-chip resources, and compliance with RoHS manufacturing practices.
Request a quote or submit an inquiry to receive pricing and availability information for EP4CE10E22C8N and to discuss how this Cyclone IV E FPGA can fit into your next design.

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