EP4CE10E22C8N

IC FPGA 91 I/O 144EQFP
Part Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 91 423936 10320 144-LQFP Exposed Pad

Quantity 695 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-EQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFP Exposed PadNumber of I/O91Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs645Number of Logic Elements/Cells10320
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits423936

Overview of EP4CE10E22C8N – Cyclone IV E Field Programmable Gate Array (FPGA) IC, 144-LQFP Exposed Pad

The EP4CE10E22C8N is a Cyclone® IV E Field Programmable Gate Array (FPGA) manufactured by Intel, offered in a 144-LQFP exposed pad package. It provides a moderate-density programmable logic fabric with on-chip embedded memory and a broad set of user I/O suitable for commercial embedded designs and prototype platforms.

Key attributes include 10,320 logic elements, approximately 0.424 Mbits of embedded memory, support for up to 91 I/O, and a low-voltage core supply range of 1.15 V to 1.25 V. The device is RoHS compliant and specified for commercial operating temperatures from 0 °C to 85 °C.

Key Features

  • Logic Capacity  10,320 logic elements providing a moderate-density fabric for custom digital logic and control functions.
  • Embedded Memory  Approximately 0.424 Mbits (423,936 bits) of on-chip RAM for buffering, state storage, and small memory-mapped functions.
  • I/O and Connectivity  Up to 91 device I/O pins to support multiple peripheral interfaces and board-level signal routing.
  • Power and Core Voltage  Core supply voltage range of 1.15 V to 1.25 V to match system power budgets and core power domains.
  • Package and Mounting  144-LQFP exposed pad package (supplier device package listed as 144-EQFP, 20 × 20) designed for surface-mount assembly with improved thermal contact through the exposed pad.
  • Operating Range and Grade  Commercial grade operation from 0 °C to 85 °C for general-purpose embedded and application development.
  • Compliance  RoHS compliant.
  • Documentation Coverage  The Cyclone IV device handbook and datasheet series include detailed sections on operating conditions, recommended operating conditions, DC characteristics, supply current, ESD performance, switching characteristics and other device-level specifications.

Typical Applications

  • Programmable logic and prototyping  Implement custom digital functions, algorithm validation, and hardware prototypes using the device's 10,320 logic elements and on-chip RAM.
  • I/O expansion and interface bridging  Bridge multiple peripheral interfaces and manage board-level signal aggregation with up to 91 user I/O.
  • Embedded control and glue logic  Replace multiple discrete components with compact programmable logic for control, sequencing, and protocol adaptation in commercial electronics.
  • Compact board-level FPGA integration  The 144-LQFP exposed pad package supports surface-mount assembly while providing thermal relief for moderate-power, compact designs.

Unique Advantages

  • Balanced logic and memory  A combination of 10,320 logic elements and ~0.424 Mbits of embedded RAM enables implementation of moderate-complexity designs without external RAM for many use cases.
  • Generous I/O count  Up to 91 I/O pins allow flexible interfacing to sensors, peripherals, and board-level signals, reducing the need for additional interface ICs.
  • Low-voltage core  The 1.15 V–1.25 V core supply aligns with modern low-voltage system power domains, supporting integration into contemporary embedded platforms.
  • Compact, serviceable package  144-LQFP with exposed pad supports surface-mount manufacturing and improved thermal performance in space-constrained assemblies.
  • Commercial temperature suitability  Specified for 0 °C to 85 °C operation to match a wide range of commercial and development applications.
  • Standards-aware manufacturing  RoHS compliance supports environmentally conscious supply-chain and manufacturing requirements.

Why Choose EP4CE10E22C8N?

The EP4CE10E22C8N positions itself as a practical, moderate-density Cyclone IV E FPGA option for engineers and teams needing flexible programmable logic, embedded RAM, and a substantial I/O complement in a compact surface-mount package. Its 10,320 logic elements and approximately 0.424 Mbits of on-chip memory provide a solid foundation for custom digital logic, protocol bridging, and prototype development while the 1.15 V–1.25 V core and 144-LQFP exposed pad package simplify power-domain integration and thermal management.

This device is well suited to development groups, OEMs, and engineering teams building commercial-grade embedded systems that require reconfigurable logic, moderate on-chip resources, and compliance with RoHS manufacturing practices.

Request a quote or submit an inquiry to receive pricing and availability information for EP4CE10E22C8N and to discuss how this Cyclone IV E FPGA can fit into your next design.

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