EP4CE10E22C9L

The EP4CE10E22C9L is a Cyclone IV E field programmable gate array (FPGA) IC from Intel, supplied in a 144‑LQFP exposed pad surface‑mount package. It delivers a balanced combination of logic capacity, embedded memory, and I/O for commercial‑grade embedded designs.

Key device specifications include 10,320 logic elements, approximately 0.424 Mbits of embedded memory, 91 general purpose I/O, a low‑voltage core supply range of 0.97 V to 1.03 V, and an operating temperature range of 0 °C to 85 °C. Detailed device parameters and guidance are available in the Cyclone IV Device Handbook and associated datasheet sections covering operating conditions, DC characteristics, power consumption, and switching specifications.

Key Features

• Core Logic — 10,320 logic elements provide a flexible fabric for implementing custom logic, state machines, and glue logic.
• Embedded Memory — Approximately 0.424 Mbits of on‑chip RAM to support FIFOs, buffering, and small data stores without external memory.
• I/O Capacity — 91 device I/O pins for interfacing to peripherals, sensors, and external logic.
• Power — Core voltage supply specified from 0.970 V to 1.030 V to match system power domains and optimize power consumption.
• Package & Mounting — 144‑LQFP exposed pad package (supplier package: 144‑EQFP 20×20) in a surface‑mount form factor for compact PCB designs and thermal conduction through the exposed pad.
• Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial applications.
• Compliance & Documentation — RoHS‑compliant and supported by the Cyclone IV Device Handbook with detailed datasheet sections covering absolute maximum ratings, recommended operating conditions, I/O specifications, and more.

Unique Advantages

• High logic density: 10,320 logic elements enable implementation of moderately complex custom logic without external ASICs.
• On‑chip memory reduces BOM: Approximately 0.424 Mbits of embedded RAM minimizes dependence on external memory for buffering and small data structures.
• Versatile I/O count: 91 I/O pins support diverse peripheral and interface requirements while keeping board routing manageable.
• Compact, serviceable package: 144‑LQFP exposed pad provides a compact PCB footprint with improved thermal path for surface‑mount assembly.
• Low‑voltage core compatibility: 0.97–1.03 V core supply aligns with modern power rails for efficient integration into low‑power systems.
• Commercial readiness: Specified 0 °C to 85 °C operating range and RoHS compliance make the device suitable for mainstream commercial electronics.

Why Choose EP4CE10E22C9L?

The EP4CE10E22C9L positions itself as a practical FPGA choice for commercial embedded designs that require a mid‑range balance of logic capacity, embedded memory, and I/O. Its 10,320 logic elements and roughly 0.424 Mbits of on‑chip RAM provide the resources to implement interface logic, protocol bridging, and custom control functions while keeping board complexity and part count down.

With a compact 144‑LQFP exposed pad package, a defined core voltage range, and comprehensive documentation in the Cyclone IV Device Handbook and datasheet, this device fits designers seeking predictable integration and clear electrical and thermal guidance for production‑grade commercial applications.

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