EP4CE10E22I7
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 91 423936 10320 144-LQFP Exposed Pad |
|---|---|
| Quantity | 228 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Last Time Buy |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-EQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP Exposed Pad | Number of I/O | 91 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 645 | Number of Logic Elements/Cells | 10320 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 423936 |
Overview of EP4CE10E22I7 – Cyclone IV E FPGA, 10,320 Logic Elements, 144‑LQFP
The EP4CE10E22I7 is a Cyclone® IV E Field Programmable Gate Array (FPGA) IC delivering 10,320 logic elements and approximately 0.424 Mbits of embedded memory. Designed for industrial-grade applications, this low-voltage core FPGA provides a compact, surface-mount package with 91 user I/O pins for mid-density custom logic and I/O aggregation.
With a specified supply voltage range of 1.15 V to 1.25 V and an operating temperature range from −40 °C to 100 °C, the device targets applications requiring robust thermal performance and RoHS compliance.
Key Features
- Core Logic 10,320 logic elements for implementing custom digital functions, state machines, and glue-logic in mid-density designs.
- Embedded Memory Approximately 0.424 Mbits of on-chip RAM to support packet buffers, FIFOs, and small lookup tables without external memory.
- I/O Capability 91 user I/O pins suitable for interfacing with sensors, peripherals, and system buses in compact designs.
- Power and Voltage Core supply specified between 1.15 V and 1.25 V, enabling designs optimized for the device’s low-voltage core requirements.
- Package & Mounting 144‑LQFP with exposed pad (supplier package: 144‑EQFP, 20×20) in a surface-mount form factor for PCB-level thermal and mechanical integration.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C, supporting deployment in temperature-challenging environments.
- Regulatory Compliance RoHS compliant for lead-free assembly in modern manufacturing processes.
Typical Applications
- Industrial Control and Automation Implements custom control logic, I/O conditioning, and deterministic state machines within an industrial temperature envelope.
- Embedded System Integration Acts as a programmable fabric for bridging peripherals, implementing protocol adapters, or offloading deterministic tasks from a host processor.
- Prototyping and Mid‑Density FPGA Designs Provides a compact platform for developing and validating mid-density digital designs where board space and I/O count are constrained.
Unique Advantages
- Balanced Logic Density: 10,320 logic elements deliver sufficient capacity for complex glue-logic and moderate feature sets without excessive BOM cost.
- On‑Chip Memory for Local Storage: Approximately 0.424 Mbits of embedded RAM reduces reliance on external memory for small buffers and lookup tables.
- Industrial‑Grade Thermal Range: −40 °C to 100 °C rating supports deployment in harsher operating environments common to industrial applications.
- Compact, Thermally Aware Package: 144‑LQFP with exposed pad enables effective PCB-level thermal management while staying compatible with surface-mount assembly.
- Low‑Voltage Core: 1.15 V to 1.25 V supply range aligns system power design with the device’s core requirements for predictable operation.
- RoHS Compliant: Meets lead-free assembly requirements for modern manufacturing processes.
Why Choose EP4CE10E22I7?
The EP4CE10E22I7 positions itself as a practical mid-density Cyclone IV E FPGA tailored for industrial applications that need reliable operation across a wide temperature range, a moderate I/O count, and a compact package. Its blend of logic elements, embedded RAM, and surface-mount 144‑LQFP packaging makes it well suited for customers integrating programmable logic into space-constrained, thermally demanding systems.
This device is a suitable choice for design teams seeking a programmable, industrial‑grade FPGA platform that balances integration, predictable power requirements, and on-chip memory for localized buffering and control tasks.
Request a quote or submit an inquiry to obtain pricing and availability for EP4CE10E22I7 and discuss how it fits your next industrial or embedded FPGA design.

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