EP4CE10E22I7

IC FPGA 91 I/O 144EQFP
Part Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 91 423936 10320 144-LQFP Exposed Pad

Quantity 228 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusLast Time Buy
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-EQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFP Exposed PadNumber of I/O91Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs645Number of Logic Elements/Cells10320
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits423936

Overview of EP4CE10E22I7 – Cyclone IV E FPGA, 10,320 Logic Elements, 144‑LQFP

The EP4CE10E22I7 is a Cyclone® IV E Field Programmable Gate Array (FPGA) IC delivering 10,320 logic elements and approximately 0.424 Mbits of embedded memory. Designed for industrial-grade applications, this low-voltage core FPGA provides a compact, surface-mount package with 91 user I/O pins for mid-density custom logic and I/O aggregation.

With a specified supply voltage range of 1.15 V to 1.25 V and an operating temperature range from −40 °C to 100 °C, the device targets applications requiring robust thermal performance and RoHS compliance.

Key Features

  • Core Logic  10,320 logic elements for implementing custom digital functions, state machines, and glue-logic in mid-density designs.
  • Embedded Memory  Approximately 0.424 Mbits of on-chip RAM to support packet buffers, FIFOs, and small lookup tables without external memory.
  • I/O Capability  91 user I/O pins suitable for interfacing with sensors, peripherals, and system buses in compact designs.
  • Power and Voltage  Core supply specified between 1.15 V and 1.25 V, enabling designs optimized for the device’s low-voltage core requirements.
  • Package & Mounting  144‑LQFP with exposed pad (supplier package: 144‑EQFP, 20×20) in a surface-mount form factor for PCB-level thermal and mechanical integration.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, supporting deployment in temperature-challenging environments.
  • Regulatory Compliance  RoHS compliant for lead-free assembly in modern manufacturing processes.

Typical Applications

  • Industrial Control and Automation  Implements custom control logic, I/O conditioning, and deterministic state machines within an industrial temperature envelope.
  • Embedded System Integration  Acts as a programmable fabric for bridging peripherals, implementing protocol adapters, or offloading deterministic tasks from a host processor.
  • Prototyping and Mid‑Density FPGA Designs  Provides a compact platform for developing and validating mid-density digital designs where board space and I/O count are constrained.

Unique Advantages

  • Balanced Logic Density: 10,320 logic elements deliver sufficient capacity for complex glue-logic and moderate feature sets without excessive BOM cost.
  • On‑Chip Memory for Local Storage: Approximately 0.424 Mbits of embedded RAM reduces reliance on external memory for small buffers and lookup tables.
  • Industrial‑Grade Thermal Range: −40 °C to 100 °C rating supports deployment in harsher operating environments common to industrial applications.
  • Compact, Thermally Aware Package: 144‑LQFP with exposed pad enables effective PCB-level thermal management while staying compatible with surface-mount assembly.
  • Low‑Voltage Core: 1.15 V to 1.25 V supply range aligns system power design with the device’s core requirements for predictable operation.
  • RoHS Compliant: Meets lead-free assembly requirements for modern manufacturing processes.

Why Choose EP4CE10E22I7?

The EP4CE10E22I7 positions itself as a practical mid-density Cyclone IV E FPGA tailored for industrial applications that need reliable operation across a wide temperature range, a moderate I/O count, and a compact package. Its blend of logic elements, embedded RAM, and surface-mount 144‑LQFP packaging makes it well suited for customers integrating programmable logic into space-constrained, thermally demanding systems.

This device is a suitable choice for design teams seeking a programmable, industrial‑grade FPGA platform that balances integration, predictable power requirements, and on-chip memory for localized buffering and control tasks.

Request a quote or submit an inquiry to obtain pricing and availability for EP4CE10E22I7 and discuss how it fits your next industrial or embedded FPGA design.

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