EP4CE10F17A7N

The EP4CE10F17A7N is a Cyclone® IV E field programmable gate array (FPGA) IC from Intel, delivered in a 256‑ball FBGA (17×17) surface‑mount package. It provides approximately 10,320 logic elements and about 0.424 Mbits of embedded RAM in a compact footprint with up to 179 I/O pins.

Designed and qualified for automotive use with AEC‑Q100, the device supports extended operating conditions (‑40 °C to 125 °C) and a 1.15 V supply, making it suitable for applications that require reliable logic integration and robust thermal performance.

Key Features

• Logic Capacity — Approximately 10,320 logic elements to implement custom digital functions and state machines within a compact FPGA.
• Embedded Memory — Approximately 0.424 Mbits of on‑chip RAM for data buffering, small lookup tables, and local storage.
• I/O Density — Up to 179 I/O pins to support multiple peripheral interfaces and system interconnects.
• Automotive Qualification — AEC‑Q100 qualification and an operating temperature range of ‑40 °C to 125 °C for deployment in automotive environments.
• Power — Single supply rail at 1.15 V, enabling predictable power budgeting in constrained designs.
• Package and Mounting — 256‑FBGA (17×17) surface‑mount package supplied in tray for automated assembly and compact system integration.
• Compliance — RoHS compliant for regulated manufacturing and environmental compatibility.

Typical Applications

• Automotive Systems — Engine control, body electronics, and domain controllers where AEC‑Q100 qualification and extended temperature range are required.
• Embedded Control and Signal Processing — Implementation of custom control logic, protocol bridging, and deterministic processing using the available logic elements and on‑chip RAM.
• Compact High‑Density Designs — Systems that benefit from a small FBGA footprint while requiring moderate logic capacity and a large number of I/Os.

Unique Advantages

• Automotive‑ready Qualification: AEC‑Q100 qualification and ‑40 °C to 125 °C operating range support deployment in vehicle electronics and harsh environments.
• Balanced Logic and Memory: Approximately 10,320 logic elements and ~0.424 Mbits of embedded RAM provide a practical balance for control, interface, and mid‑scale compute tasks.
• High I/O Count: 179 I/Os enable rich peripheral connectivity and flexible system partitioning without external multiplexing.
• Compact FBGA Package: The 256‑FBGA (17×17) package supports space‑constrained board designs while allowing automated surface‑mount assembly.
• Predictable Power Envelope: Single 1.15 V supply simplifies power rail design and system power analysis.
• Regulatory Compliance: RoHS compliance facilitates integration into production lines with environmental standards.

Why Choose EP4CE10F17A7N?

The EP4CE10F17A7N delivers a practical combination of logic capacity, embedded memory, and a high I/O count in a compact 256‑FBGA package, making it well suited to embedded and automotive applications that require reliable operation across an extended temperature range. Its AEC‑Q100 qualification and RoHS compliance provide the quality and environmental characteristics expected for production use in regulated markets.

Ideal for designers who need mid‑density programmable logic with automotive qualification, this Cyclone® IV E device enables integration of custom control and interfacing functions while maintaining a small board footprint and straightforward power requirements.

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