EP4CE10F17C6N
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 179 423936 10320 256-LBGA |
|---|---|
| Quantity | 342 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 179 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 645 | Number of Logic Elements/Cells | 10320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 423936 |
Overview of EP4CE10F17C6N – Cyclone® IV E Field Programmable Gate Array (FPGA) IC 179 423936 10320 256-LBGA
The EP4CE10F17C6N is a Cyclone® IV E Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 256-ball BGA package. It provides a programmable logic fabric intended for designs that require customizable digital logic, on-chip memory, and a moderate number of I/O signals.
With 10,320 logic elements and approximately 0.424 Mbits of embedded memory, this commercial-grade device balances integration and power efficiency for a range of system-level implementations that rely on field-programmable logic.
Key Features
- Programmable Logic – 10,320 logic elements available for implementing custom digital logic and state machines.
- Embedded Memory – Approximately 0.424 Mbits of on-chip RAM for buffering, FIFOs, and small data storage.
- I/O Count – 179 user I/O pins to interface with peripherals, sensors, and system buses.
- Power Supply – Core voltage support from 1.15 V to 1.25 V, enabling compatibility with low-voltage system domains.
- Package & Mounting – Available in a 256-ball BGA package (specified as 256-LBGA; supplier device package listed as 256-FBGA 17×17) and designed for surface mount assembly.
- Operating Range – Commercial operating temperature range from 0 °C to 85 °C, suitable for standard commercial applications.
- Regulatory – RoHS-compliant for restricted-substance conformance.
- Documentation – Supported by Cyclone IV device documentation and device handbook material provided by the manufacturer.
Typical Applications
- Embedded control and logic – Implement custom control functions, glue logic, and state machines where reprogrammability is required.
- Interface bridging – Provide flexible I/O routing and protocol adaptation between system components using the available 179 I/O pins.
- Data buffering and preprocessing – Use the on-chip RAM for temporary storage, FIFOs, and small-scale data manipulation tasks in real-time pipelines.
Unique Advantages
- Flexible integration: The combination of 10,320 logic elements and 179 I/O pins supports consolidation of multiple discrete functions into a single programmable device, reducing board-level BOM.
- On-chip memory: Approximately 0.424 Mbits of embedded RAM enables localized buffering and state storage without immediate reliance on external memory.
- Low-voltage core: 1.15 V–1.25 V core supply supports designs targeting lower-power core domains and modern system power architectures.
- Commercial-grade thermal range: Rated for 0 °C to 85 °C operation, matching typical commercial electronics deployment scenarios.
- Surface-mount BGA package: 256-ball BGA packaging supports compact board layouts and industry-standard surface-mount assembly processes.
- RoHS compliant: Meets restricted-substance requirements for environmentally conscious manufacturing and procurement.
Why Choose EP4CE10F17C6N?
The EP4CE10F17C6N Cyclone IV E FPGA provides a practical balance of programmable logic resources, on-chip memory, and I/O density in a compact BGA package for commercial applications. Its documented operating range, RoHS compliance, and manufacturer-backed device documentation make it suitable for teams seeking a field-programmable solution that integrates logic, I/O, and embedded memory on a single device.
This device is well suited for design teams implementing custom logic, interface adaptation, or localized data handling in compact systems where reconfigurability and integration reduce system complexity and parts count.
Request a quote or submit an inquiry to learn about availability, pricing, and ordering for the EP4CE10F17C6N. Our sales team can provide lead-time information and help match device quantities to your project timeline.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018