EP4CE10F17C8

The EP4CE10F17C8 is a Cyclone IV E field programmable gate array (FPGA) offered in a 256-LBGA package. It provides programmable logic resources and flexible I/O in a commercial-grade device.

With 10,320 logic elements, approximately 0.424 Mbits of embedded RAM, and 179 I/O pins, this device targets designs that require moderate logic density, on-chip memory, and a high pin count within a surface-mount BGA footprint.

Key Features

• Logic Capacity — 10,320 logic elements available for implementing custom digital logic, state machines, and glue logic.
• Embedded Memory — Approximately 0.424 Mbits of on-chip RAM for buffers, FIFOs, and small data structures.
• I/O Resources — 179 user I/O pins to support multiple peripheral interfaces and board-level connectivity.
• Power Supply — Core voltage requirement of 1.15 V to 1.25 V for system power planning and regulator selection.
• Package & Mounting — Available in a 256-LBGA package; supplier device package listed as 256-FBGA (17 × 17). Surface-mount mounting type suited to standard PCB assembly.
• Operating Range & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• RoHS Compliant — Meets RoHS requirements for lead-free assembly and environmental compliance.

Typical Applications

• Embedded Logic and Glue — Implement custom control logic, bus bridging, and peripheral arbitration in commercial electronic systems.
• Interface Aggregation — Consolidate multiple I/O signals and manage protocol translation using the device’s 179 I/O pins.
• Prototyping and Development — Use as a development platform for validating logic architectures that require moderate density and embedded RAM.

Unique Advantages

• Balanced Logic Density: 10,320 logic elements provide a midpoint option for designs needing more resource than low-density devices but less than high-end parts.
• On-Chip Memory: Approximately 0.424 Mbits of embedded RAM reduces dependence on external memory for small buffering and state storage.
• High I/O Count: 179 I/O pins enable flexible board-level connections and the ability to service multiple peripherals without additional multiplexing logic.
• Compact BGA Packaging: 256-ball package (256-LBGA / 256-FBGA 17×17) allows high pin count in a compact footprint for space-constrained PCBs.
• Commercial Temperature Range: Rated for 0 °C to 85 °C, suitable for standard commercial electronic products and environments.
• RoHS Compliance: Lead-free compatibility simplifies integration into modern, regulation-compliant manufacturing flows.

Why Choose EP4CE10F17C8?

EP4CE10F17C8 positions itself as a practical Cyclone IV E FPGA option for commercial designs that need moderate logic capacity, embedded RAM, and a substantial I/O count in a compact BGA package. Its 1.15–1.25 V core supply and surface-mount 256-ball package accommodate common PCB and power architectures.

This part is well suited to engineering teams developing mid-density programmable logic solutions, interface concentrators, or prototype platforms where on-chip memory and many I/Os reduce external component count and simplify board design. RoHS compliance and commercial temperature rating support typical production and deployment requirements.

Request a quote or submit an inquiry to receive pricing and availability for EP4CE10F17C8 and to discuss how this Cyclone IV E FPGA can fit into your next design.