EP4CE10F17C7N
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 179 423936 10320 256-LBGA |
|---|---|
| Quantity | 33 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 179 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 645 | Number of Logic Elements/Cells | 10320 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 423936 |
Overview of EP4CE10F17C7N – Cyclone® IV Field Programmable Gate Array (FPGA)
The EP4CE10F17C7N is a Cyclone IV family FPGA manufactured by Intel, supplied in a 256-ball BGA package and intended for commercial temperature applications. It provides a compact, low-voltage core and a combination of logic capacity, embedded memory and a large I/O count to support a range of configurable digital designs.
This device is specified for a 1.15 V to 1.25 V core supply, operates over a 0 °C to 85 °C range, and is RoHS compliant—making it suitable for standard commercial embedded and system-integration designs that require on-chip logic and memory resources in a small BGA footprint.
Key Features
- Logic Capacity 10,320 logic elements (cells) for implementing custom digital functions and control logic.
- Embedded Memory Approximately 0.42 Mbits (423,936 bits) of on-chip RAM to store buffers, state machines, and small data sets directly on the FPGA fabric.
- I/O Resources 179 user I/O pins to interface with external devices, sensors, and peripherals.
- Power and Core Voltage Designed for a core supply range of 1.15 V to 1.25 V to match system power-rail requirements.
- Package and Mounting 256-ball LBGA package (supplier device package listed as 256-FBGA, 17×17), surface-mount mounting for compact PCB layouts.
- Operating Temperature and Grade Commercial grade device rated for 0 °C to 85 °C operation.
- Compliance RoHS compliant, supporting environmental and regulatory requirements for lead-free assembly.
- Documentation Supported by Cyclone IV device documentation (Cyclone IV Device Handbook) and device datasheet materials for electrical and timing specifications.
Typical Applications
- Embedded Control and Glue Logic Implement custom state machines, protocol adaptation, or control functions where integrated logic and moderate on-chip memory are required.
- Interface Bridging Use the available 179 I/Os to connect disparate peripherals and perform signal conditioning or protocol translation on a single device.
- Prototyping and Development Evaluate custom logic functions and system architectures using a commercial-grade Cyclone IV FPGA in a compact BGA package.
Unique Advantages
- Balanced logic and memory mix: 10,320 logic elements combined with approximately 0.42 Mbits of on-chip RAM enable mid-range logic integration without external memory for many control and buffering tasks.
- High I/O count in a compact package: 179 user I/Os in a 256-ball LBGA (17×17 supplier FBGA) footprint help reduce PCB area while maintaining strong interfacing capability.
- Low-voltage core operation: 1.15–1.25 V supply minimizes core power requirements and aligns with common FPGA power-rail configurations.
- Commercial temperature rating: Specified 0 °C to 85 °C operation for standard commercial deployments.
- RoHS compliant: Supports lead-free manufacturing processes and environmental compliance for contemporary assembly flows.
Why Choose EP4CE10F17C7N?
The EP4CE10F17C7N delivers a practical combination of logic density, embedded RAM, and extensive I/O in a compact 256-ball BGA package. Its Cyclone IV architecture and documented device datasheet provide the electrical and timing details engineers need to integrate configurable logic into commercial embedded systems.
This part is well suited to designers seeking a mid-range FPGA for control logic, interface consolidation, and prototype-to-production workflows, offering sustained vendor documentation support and RoHS compliance for modern assembly requirements.
Request a quote or submit an inquiry to check availability, pricing, and lead times for EP4CE10F17C7N. Technical datasheet and device handbook materials are available to help evaluate the device for your design requirements.

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