EP4CE10E22C7

The EP4CE10E22C7 is a Cyclone® IV E Field Programmable Gate Array (FPGA) IC from Intel, offering programmable logic in a compact 144-LQFP exposed pad package. The device provides 10,320 logic elements, 645 LABs, and approximately 0.424 Mbits of on‑chip RAM, making it suitable for designs that require significant on-chip combinational and memory resources within a commercial temperature range.

Key device electrical and mechanical characteristics include a core supply range of 1.15 V to 1.25 V, 91 general-purpose I/O, surface-mount mounting, and RoHS compliance—documented in the Cyclone IV device handbook and accompanying datasheet.

Key Features

• Core Logic  The device contains 10,320 logic elements organized into 645 LABs, enabling substantial programmable logic density for custom digital functions.
• Embedded Memory  Approximately 0.424 Mbits (423,936 bits) of on-chip RAM support buffering, FIFOs, and small lookup tables without external memory.
• I/O Capacity  Up to 91 I/O pins provide flexible interfacing options for peripherals, sensors, and external devices.
• Power  Core supply voltage specified between 1.15 V and 1.25 V, allowing designs to target the device’s recommended operating conditions.
• Package & Mounting  144-LQFP exposed pad package (supplier device package: 144-EQFP, 20×20) in a surface-mount form factor for PCB assembly and thermal management via exposed pad.
• Temperature & Grade  Commercial temperature rating with operating range from 0 °C to 85 °C, suitable for commercial-grade embedded applications.
• Compliance  RoHS compliant, supporting regulatory requirements for lead-free assemblies.

Typical Applications

• Custom digital logic and prototyping  Implement and iterate complex state machines, glue logic, and protocol bridges using on-chip logic and memory.
• Embedded control and automation  Integrate control logic and I/O handling in commercial embedded systems where a compact surface-mount FPGA package is required.
• Signal processing and buffering  Use the device’s embedded RAM for small buffering, FIFO implementation, and intermediate data storage in digital signal paths.
• Peripheral and interface aggregation  Consolidate multiple peripheral interfaces onto a single device using the available I/O and programmable fabric.

Unique Advantages

• Substantial programmable capacity: 10,320 logic elements and 645 LABs provide the programmable resources needed to implement complex logic without external ASICs.
• On-chip memory availability: Approximately 0.424 Mbits of embedded RAM reduce reliance on external memory for moderate buffering and LUT storage.
• Flexible I/O count: 91 I/O pins allow direct connections to a wide range of peripherals, reducing board-level glue logic.
• Compact, manufacturable package: 144-LQFP exposed pad in a surface-mount form factor enables efficient PCB integration and thermal conduction through the exposed pad.
• Commercial temperature grading: Rated 0 °C to 85 °C for deployment in commercial embedded systems and products.
• Regulatory readiness: RoHS compliant to support lead-free manufacturing processes.

Why Choose EP4CE10E22C7?

The EP4CE10E22C7 delivers a balanced combination of programmable logic density, embedded memory, and I/O capacity in a compact 144-LQFP exposed-pad package. Its specified core voltage range and documented operating conditions make it a clear option for commercial embedded designs that require on-chip logic and memory without adding external devices.

Backed by Intel’s Cyclone IV E device documentation, the part is suitable for engineering teams building prototypes through production runs where integration, package size, and RoHS compliance are design considerations. The device’s specification profile supports straightforward scalability within designs that leverage similar Cyclone IV E family devices.

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