EP4CE10E22C6N

The EP4CE10E22C6N is a Cyclone® IV E field-programmable gate array (FPGA) packaged in a 144-LQFP exposed-pad surface-mount package. It offers 10,320 logic elements, approximately 0.424 Mbits of embedded RAM, and 91 general-purpose I/Os, making it suitable for compact, programmable digital logic implementations.

With a low-voltage core supply range of 1.15 V to 1.25 V and a commercial operating temperature range of 0 °C to 85 °C, this device targets commercial-grade designs that require a balance of integration density, on-chip memory, and I/O connectivity in a standard LQFP footprint.

Key Features

• Core Logic — 10,320 logic elements (LEs) for implementing custom digital functions, state machines, and glue logic within a single FPGA device.
• On-Chip Memory — Approximately 0.424 Mbits (423,936 bits) of embedded RAM to support buffering, FIFOs, and local data storage without external memory.
• I/O Connectivity — 91 I/Os available for interfacing to peripherals, sensors, or external logic, providing flexible signal routing for mid-scale designs.
• Power and Core Voltage — Core voltage supply range of 1.15 V to 1.25 V to match low-voltage system designs and power domains.
• Package and Mounting — 144-LQFP exposed pad (supplier package: 144-EQFP, 20×20 mm) in a surface-mount format for compact board-level integration and thermal conduction via exposed pad.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for conventional commercial applications.
• Regulatory Compliance — RoHS compliant, supporting lead-free manufacturing processes and environmental requirements.
• Documentation — Device is part of the Cyclone IV family with accompanying Cyclone IV Device Handbook material available for detailed electrical and timing characteristics.

Typical Applications

• Custom digital logic and prototyping — Use the 10,320 logic elements and 91 I/Os to implement and validate application-specific logic, glue logic, and prototype designs on a compact LQFP package.
• Embedded buffering and local data handling — Approximately 0.424 Mbits of on-chip RAM supports buffering, packet staging, and small data-storage functions without external memory.
• Low-voltage system integration — The 1.15 V to 1.25 V core supply range enables integration into low-voltage power architectures common in modern electronic designs.
• Space-constrained board designs — The 144-LQFP (20×20 mm) exposed-pad, surface-mount package accommodates high-density layouts while providing a thermal path through the exposed pad.

Unique Advantages

• Balanced integration density: 10,320 logic elements combined with substantial on-chip RAM reduce the need for multiple external ICs in mid-scale designs.
• Flexible I/O count: Ninety-one I/Os enable diverse interfacing options for sensors, peripherals, and external logic without consuming excessive board area.
• Compact package with thermal path: The 144-LQFP exposed pad form factor supports tight PCB layouts while providing improved thermal dissipation compared with standard QFP packages.
• Low-voltage core compatibility: The narrow core voltage window (1.15 V–1.25 V) aligns with low-voltage system power rails for straightforward power-domain design.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant to meet common commercial deployment requirements.
• Documented device family: Part of the Cyclone IV product family with published Cyclone IV Device Handbook content for design and characterization reference.

Why Choose EP4CE10E22C6N?

The EP4CE10E22C6N positions itself as a compact, commercially graded Cyclone IV E FPGA option for designers who need approximately 10K logic elements, significant on-chip RAM, and a moderate I/O count in a 144-LQFP exposed-pad package. Its low-voltage core and surface-mount package make it suitable for modern, space-constrained board designs that require programmable logic integration without sacrificing thermal considerations.

Choose this device for mid-scale FPGA implementations where integration, documented device behavior, and RoHS compliance matter. The combination of logic capacity, embedded memory, and a 20×20 mm exposed-pad LQFP footprint delivers a pragmatic balance of performance and manufacturability for commercial applications.

Request a quote or submit a sourcing inquiry to obtain pricing, availability, and lead-time information for EP4CE10E22C6N.