EP4CE10E22A7N

IC FPGA 91 I/O 144EQFP
Part Description

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 91 423936 10320 144-LQFP Exposed Pad

Quantity 114 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package144-EQFP (20x20)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case144-LQFP Exposed PadNumber of I/O91Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs645Number of Logic Elements/Cells10320
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits423936

Overview of EP4CE10E22A7N – Cyclone® IV E FPGA, 10,320 logic elements, 423,936 bits RAM, 144‑LQFP Exposed Pad

The EP4CE10E22A7N is a Cyclone® IV E field programmable gate array (FPGA) designed for embedded and automotive-aware applications. It integrates 10,320 logic elements, approximately 0.424 Mbits of on-chip RAM, and 91 user I/O to support compact, configurable digital systems.

With AEC‑Q100 qualification, a wide operating temperature range and a low core-voltage supply window, this device targets use cases that require robust operation, high integration and predictable power characteristics in a surface-mount 144‑LQFP exposed pad package.

Key Features

  • Logic Capacity — 10,320 logic elements provide programmable fabric for glue logic, state machines, and moderate-scale custom datapaths.
  • Embedded Memory — 423,936 bits of on-chip RAM (approximately 0.424 Mbits) for buffering, small FIFOs, and on-chip storage.
  • Package and I/O — 91 user I/O pins in a 144‑LQFP exposed pad package (supplier device package: 144‑EQFP 20×20); surface-mount mounting supports compact board layouts and thermal conduction via the exposed pad.
  • Power Supply — Core voltage support from 1.15 V to 1.25 V enabling predictable power design for the FPGA core domain.
  • Automotive Qualification — AEC‑Q100 qualification and an operating temperature range from −40 °C to 125 °C for designs requiring automotive-grade qualification.
  • Mounting and Thermal — Surface-mount device with exposed thermal pad to assist thermal management on PCB designs.

Typical Applications

  • Automotive Systems — Ideal for vehicle control and signal-processing sub-systems where AEC‑Q100 qualification and extended temperature range are required.
  • Embedded Control — Suited to motor control, sensor interfacing and deterministic control tasks that benefit from on-chip logic and memory.
  • Communication Interfaces — Provides configurable I/O and programmable logic for protocol bridging, custom interface logic and small packet buffering.
  • Industrial Electronics — Useful in factory automation and instrumentation requiring robust temperature performance and field-programmable flexibility.

Unique Advantages

  • Automotive-Grade Qualification: AEC‑Q100 qualification and −40 °C to 125 °C operation support designs that require automotive-level environmental robustness.
  • Compact, High-Integration Package: 144‑LQFP exposed pad package with 91 I/O reduces PCB footprint while providing effective thermal dissipation.
  • Balanced Logic and Memory: 10,320 logic elements combined with approximately 0.424 Mbits of RAM enable mixed control and buffering functions on a single device.
  • Predictable Core Power: Narrow core-voltage range (1.15 V to 1.25 V) simplifies power supply design and helps maintain consistent performance.
  • Surface-Mount Convenience: Standard surface-mount package supports automated assembly and industry-standard PCB manufacturing processes.

Why Choose EP4CE10E22A7N?

The EP4CE10E22A7N positions itself as a compact, automotive‑qualified FPGA option for designers who need mid-range programmable logic capacity with embedded memory and a robust thermal/temperature envelope. Its combination of 10,320 logic elements, substantial on-chip RAM and 91 I/O pins in a 144‑LQFP exposed pad package makes it a practical choice for embedded control, interface bridging and vehicle-grade subsystem designs.

Choose this device when you require a field-programmable solution that balances integration, predictable power requirements and AEC‑Q100 qualification—helping simplify BOMs and consolidate functions while supporting long-term deployment in demanding environments.

Request a quote or submit an inquiry today to get pricing and availability for EP4CE10E22A7N. Our team will assist with lead times and ordering details.

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