EP4CE10E22A7N
| Part Description |
Cyclone® IV E Field Programmable Gate Array (FPGA) IC 91 423936 10320 144-LQFP Exposed Pad |
|---|---|
| Quantity | 114 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-EQFP (20x20) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP Exposed Pad | Number of I/O | 91 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 645 | Number of Logic Elements/Cells | 10320 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 423936 |
Overview of EP4CE10E22A7N – Cyclone® IV E FPGA, 10,320 logic elements, 423,936 bits RAM, 144‑LQFP Exposed Pad
The EP4CE10E22A7N is a Cyclone® IV E field programmable gate array (FPGA) designed for embedded and automotive-aware applications. It integrates 10,320 logic elements, approximately 0.424 Mbits of on-chip RAM, and 91 user I/O to support compact, configurable digital systems.
With AEC‑Q100 qualification, a wide operating temperature range and a low core-voltage supply window, this device targets use cases that require robust operation, high integration and predictable power characteristics in a surface-mount 144‑LQFP exposed pad package.
Key Features
- Logic Capacity — 10,320 logic elements provide programmable fabric for glue logic, state machines, and moderate-scale custom datapaths.
- Embedded Memory — 423,936 bits of on-chip RAM (approximately 0.424 Mbits) for buffering, small FIFOs, and on-chip storage.
- Package and I/O — 91 user I/O pins in a 144‑LQFP exposed pad package (supplier device package: 144‑EQFP 20×20); surface-mount mounting supports compact board layouts and thermal conduction via the exposed pad.
- Power Supply — Core voltage support from 1.15 V to 1.25 V enabling predictable power design for the FPGA core domain.
- Automotive Qualification — AEC‑Q100 qualification and an operating temperature range from −40 °C to 125 °C for designs requiring automotive-grade qualification.
- Mounting and Thermal — Surface-mount device with exposed thermal pad to assist thermal management on PCB designs.
Typical Applications
- Automotive Systems — Ideal for vehicle control and signal-processing sub-systems where AEC‑Q100 qualification and extended temperature range are required.
- Embedded Control — Suited to motor control, sensor interfacing and deterministic control tasks that benefit from on-chip logic and memory.
- Communication Interfaces — Provides configurable I/O and programmable logic for protocol bridging, custom interface logic and small packet buffering.
- Industrial Electronics — Useful in factory automation and instrumentation requiring robust temperature performance and field-programmable flexibility.
Unique Advantages
- Automotive-Grade Qualification: AEC‑Q100 qualification and −40 °C to 125 °C operation support designs that require automotive-level environmental robustness.
- Compact, High-Integration Package: 144‑LQFP exposed pad package with 91 I/O reduces PCB footprint while providing effective thermal dissipation.
- Balanced Logic and Memory: 10,320 logic elements combined with approximately 0.424 Mbits of RAM enable mixed control and buffering functions on a single device.
- Predictable Core Power: Narrow core-voltage range (1.15 V to 1.25 V) simplifies power supply design and helps maintain consistent performance.
- Surface-Mount Convenience: Standard surface-mount package supports automated assembly and industry-standard PCB manufacturing processes.
Why Choose EP4CE10E22A7N?
The EP4CE10E22A7N positions itself as a compact, automotive‑qualified FPGA option for designers who need mid-range programmable logic capacity with embedded memory and a robust thermal/temperature envelope. Its combination of 10,320 logic elements, substantial on-chip RAM and 91 I/O pins in a 144‑LQFP exposed pad package makes it a practical choice for embedded control, interface bridging and vehicle-grade subsystem designs.
Choose this device when you require a field-programmable solution that balances integration, predictable power requirements and AEC‑Q100 qualification—helping simplify BOMs and consolidate functions while supporting long-term deployment in demanding environments.
Request a quote or submit an inquiry today to get pricing and availability for EP4CE10E22A7N. Our team will assist with lead times and ordering details.

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