EP3SL70F780I4L

The EP3SL70F780I4L is a Stratix® III L Field Programmable Gate Array (FPGA) IC from Intel, offering substantial on-chip logic and memory in a 780-ball FCBGA package. Designed for industrial-grade applications, it provides a combination of large logic capacity, extensive I/O, and industrial operating temperature support for demanding embedded and control designs.

Key Features

• Core Logic 67,500 logic elements to implement complex custom logic, state machines, and processing pipelines.
• Embedded Memory Approximately 2.7 Mbits of on-chip RAM for buffering, lookup tables, and local data storage.
• I/O Capacity 488 configurable I/O pins enabling wide external connectivity for sensors, peripherals, and parallel interfaces.
• Package & Mounting 780-BBGA (FCBGA) package, supplier device package 780-FBGA (29×29), designed for surface-mount assembly.
• Power Core supply operating range: 0.86 V to 1.15 V, suitable for low-voltage core domains.
• Industrial Reliability Rated for industrial grade operation with an ambient temperature range of −40 °C to 100 °C.
• Environmental Compliance RoHS compliant.

Typical Applications

• Industrial Control Systems — High logic density and industrial temperature rating enable reliable custom control and automation logic.
• Embedded Processing — Large on-chip memory and logic resources support real-time data handling and protocol implementation.
• I/O-Intensive Designs — 488 I/O pins accommodate complex sensor arrays, parallel interfaces, and mixed-signal front ends.
• Prototyping and Custom Accelerators — Substantial logic and RAM make the device suitable for prototyping bespoke hardware accelerators and digital signal processing blocks.

Unique Advantages

• High Logic Density: 67,500 logic elements allow consolidation of multiple functions into a single FPGA, simplifying system architecture.
• Significant Embedded Memory: Approximately 2.7 Mbits of on-chip RAM reduces dependence on external memory for many applications.
• Broad I/O Count: 488 I/O pins provide flexibility to interface with numerous peripherals and external subsystems without additional glue logic.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in harsh and temperature-variable environments.
• Compact Surface-Mount Package: 780-FBGA (29×29) package offers a balance of capacity and board-level density for space-constrained designs.
• RoHS Compliance: Environmentally compliant manufacturing and materials.

Why Choose EP3SL70F780I4L?

The EP3SL70F780I4L positions itself as a robust option for engineers who need sizable logic resources, substantial embedded memory, and a high pin count in an industrial-grade FPGA. Its combination of 67,500 logic elements, approximately 2.7 Mbits of RAM, and 488 I/O pins makes it well suited for systems that demand integration of multiple digital functions while maintaining board-level density through a 780-FBGA surface-mount package.

Designed for industrial environments, the device’s operating temperature range and RoHS compliance provide the reliability and regulatory alignment required for long-term deployments. Choose this part when your design requires large programmable logic capacity and broad I/O in an industrial-grade FPGA package.

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