EP3SL70F780I4LG

The EP3SL70F780I4LG is an Intel Stratix® III L FPGA supplied in a 780-ball FCBGA package. It delivers a balance of logic, embedded memory, and DSP capability for high-performance, industrial-grade applications that require configurable hardware acceleration, memory interfaces, and flexible I/O.

Built on the Stratix III L architecture, this device combines selectable core voltage and power-optimization features with a large logic capacity and substantial on-chip RAM to support demanding digital signal processing, embedded systems, and high-speed interface designs.

Key Features

• Logic Capacity — 67,500 logic elements suitable for complex combinational and sequential logic implementations.
• Embedded Memory — Approximately 2.7 Mbits of on-chip RAM (2,699,264 bits) for FIFOs, buffers, and embedded data storage.
• I/O Density — 488 user I/O pins to support a wide range of external interfaces and modular I/O bank configurations.
• Package and Mounting — 780-ball BGA (FCBGA) package, supplier device package 780-FBGA (29×29); surface-mount mounting for board-level integration.
• Power and Core Voltage — Selectable core voltage with device supply range from 860 mV to 1.15 V to enable power/performance tradeoffs.
• Industrial Temperature Range — Rated for −40 °C to 100 °C operation for deployment in industrial environments.
• Series-Level Capabilities — Stratix III family features referenced in the device handbook include Programmable Power Technology, high-speed DSP blocks, multiple PLLs and global/regional/peripheral clock resources, AES configuration key support, and support for memory interfaces.
• Standards and Compliance — RoHS compliant for environmental compliance.

Typical Applications

• High-performance logic and DSP — Implement compute-intensive signal processing, filtering, and acceleration functions using the device's large logic array and on-chip memory.
• Memory interface controllers — Use the device where robust on-chip memory and I/O support are needed for DDR/SDRAM controller implementations and buffering.
• Networking and communications — Deploy in networking equipment that requires flexible I/O, clocking, and programmable data-paths.
• Embedded systems — Integrate Nios II soft-processor-based or custom embedded designs leveraging the device’s logic, memory, and clocking resources.

Unique Advantages

• High integration: 67,500 logic elements and roughly 2.7 Mbits of embedded RAM reduce external component count and simplify board design.
• Flexible power/performance: Selectable core voltage (860 mV–1.15 V) lets designers tune power consumption versus performance for each design.
• Industrial readiness: Rated for −40 °C to 100 °C, supporting deployment in industrial temperature environments.
• Robust I/O capacity: 488 user I/O pins enable dense external interfacing for memory, sensors, transceivers, and control signals.
• Surface-mount FCBGA package: 780-ball, 29×29 FBGA offers a compact footprint with high pin density for space-constrained boards.
• Compliance and reliability: RoHS compliance and series-level features such as configuration security and clocking resources contribute to dependable system designs.

Why Choose EP3SL70F780I4LG?

The EP3SL70F780I4LG positions itself as a versatile, industrial-grade FPGA for applications that demand substantial logic capacity, embedded memory, and flexible I/O in a compact FCBGA package. Its selectable core voltage and Stratix III family capabilities make it suitable for designs where power/performance tuning, DSP processing, and complex memory interfacing are required.

Choose this device when you need a scalable, robust platform for embedded systems, high-speed communications, or signal-processing applications that benefit from on-chip resources and industrial temperature operation.

Request a quote or submit an inquiry to purchase EP3SL70F780I4LG and discuss availability and pricing for your next project.