EP3SL70F780I3N

The EP3SL70F780I3N is a Stratix® III L Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 780-FBGA (29×29) package for surface-mount applications. It provides a high-density programmable logic fabric with 67,500 logic elements and approximately 2.7 Mbits of embedded memory, along with extensive I/O and industrial-grade operating range.

Designed for applications that require substantial on-chip logic capacity and flexible I/O, this device combines high logic density, broad I/O availability, and a compact FCBGA package while supporting low-voltage operation across a wide industrial temperature range.

Key Features

• Logic Capacity  67,500 logic elements (cells) to implement complex digital logic and custom accelerators.
• Embedded Memory  Total on-chip RAM of 2,699,264 bits — approximately 2.7 Mbits of embedded memory for buffering, FIFOs, and state storage.
• I/O Resources  488 user I/O pins to support extensive peripheral interfacing and multi-channel connectivity.
• Power and Core Voltage  Core supply range from 860 mV to 1.15 V to match system power architectures and enable low-voltage designs.
• Package and Mounting  780-BBGA (FCBGA) package (780-FBGA, 29×29) in a surface-mount form factor for compact PCB integration.
• Industrial Temperature Range  Rated for operation from -40°C to 100°C, suitable for industrial-environment deployments.
• RoHS Compliance  Device is RoHS compliant for environmental and regulatory considerations.

Typical Applications

• Industrial Control Systems  Leverages the industrial temperature rating and high logic density for motor control, PLCs, and factory automation where robust operation is required.
• Communications Infrastructure  Uses abundant logic resources, embedded memory, and 488 I/O to implement protocol processing, packet handling, and interface bridging.
• Signal Processing and Acceleration  Provides the logic and on-chip RAM needed for custom DSP pipelines, data buffering, and hardware acceleration tasks.
• Prototyping and Embedded Platforms  Supports development of complex digital prototypes and system-on-chip (SoC) integration with extensive I/O and embedded memory.

Unique Advantages

• High Logic Density: 67,500 logic elements enable large-scale custom logic implementations without external glue logic.
• Substantial On-Chip Memory: Approximately 2.7 Mbits of embedded RAM supports buffering and state retention to simplify system design.
• Broad I/O Count: 488 I/O pins provide flexibility for multi-channel interfaces and parallel connectivity to peripherals and external devices.
• Industrial-Grade Operating Range: Rated from -40°C to 100°C for reliable performance in demanding environmental conditions.
• Compact FCBGA Package: 780-FBGA (29×29) surface-mount package balances board space efficiency with dense connectivity.
• Low-Voltage Core Support: Core supply range down to 860 mV enables integration into power-sensitive designs.

Why Choose EP3SL70F780I3N?

The EP3SL70F780I3N positions itself as a high-density, industrial-grade FPGA solution from Intel’s Stratix® III L family, combining large logic capacity, substantial embedded memory, and expansive I/O in a compact FCBGA package. Its low-voltage core support and wide operating temperature range make it suitable for systems that require reliable digital processing in challenging environments.

This device is well suited for designers and development teams building complex digital systems—such as industrial controllers, communications equipment, and signal-processing accelerators—that require integrated memory, many I/O channels, and a compact board footprint while maintaining industrial operating robustness.

Request a quote or submit a pricing and availability inquiry to get started with EP3SL70F780I3N for your next design.