EP3SL70F780I3

The EP3SL70F780I3 is a Stratix® III L field programmable gate array (FPGA) IC from Intel, offering 67,500 logic elements, approximately 2.7 Mbits of on-chip RAM, and 488 I/O pins. Packaged in a 780-BBGA (FCBGA) footprint with a supplier device package of 780-FBGA (29×29), it is a high-density programmable device for complex logic integration.

Built to support industrial deployments, the device operates over a –40 °C to 100 °C temperature range, is RoHS compliant, and requires a core voltage supply between 860 mV and 1.15 V. Surface-mount packaging and the 780-ball BGA footprint enable compact board integration where significant logic and memory capacity are required.

Key Features

• Core Logic  67,500 logic elements provide substantial on-chip programmable logic capacity for implementing complex digital designs.
• Embedded Memory  Approximately 2.7 Mbits of on-chip RAM (2,699,264 bits) supports data buffering, state storage, and other memory-localized functions without external RAM.
• I/O Count  488 I/O pins enable broad connectivity and interfacing with external peripherals and subsystems.
• Voltage Supply  Core operating voltage range from 860 mV to 1.15 V, suitable for the device’s specified power requirements.
• Package & Mounting  780-ball BGA (FCBGA) package; supplier device package listed as 780-FBGA (29×29). Surface mount form factor for PCB assembly.
• Temperature & Grade  Industrial grade device rated for operation from –40 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Unique Advantages

• High integration density: 67,500 logic elements combined with approximately 2.7 Mbits of embedded RAM allow larger functions to be implemented on-chip, reducing dependence on external logic and memory.
• Extensive I/O capability: 488 I/O pins provide flexibility for interfacing multiple buses, sensors, and peripherals without immediate need for external expansion.
• Industrial robustness: Specified –40 °C to 100 °C operating range and industrial grade designation support deployment in environments with wide temperature variation.
• Compact board footprint: 780-ball FCBGA package and surface-mount design enable high-density PCB layouts for space-constrained applications.
• Standards-compliant manufacturing: RoHS compliance supports use in lead-free assembly processes and regulatory requirements for many markets.

Why Choose EP3SL70F780I3?

The EP3SL70F780I3 positions itself as a high-density, industrial-grade Stratix® III L FPGA suited for designs requiring substantial programmable logic, embedded memory, and broad I/O in a compact BGA package. Its combination of 67,500 logic elements, approximately 2.7 Mbits of on-chip RAM, and 488 I/Os makes it appropriate for engineers seeking significant on-chip integration while maintaining an industrial temperature rating.

Backed by Intel’s Stratix® III L family heritage and delivered in a 780-ball FCBGA surface-mount package, the EP3SL70F780I3 offers a balance of capacity, packaging density, and environmental compliance for long-term deployment in industrial applications.

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