EP3SL70F780C4LG
| Part Description |
Stratix® III L Field Programmable Gate Array (FPGA) IC 488 2699264 67500 780-BBGA, FCBGA |
|---|---|
| Quantity | 1,432 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 488 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2700 | Number of Logic Elements/Cells | 67500 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 2699264 |
Overview of EP3SL70F780C4LG – Stratix® III L FPGA, 67,500 logic elements, 780-FBGA (29×29)
The EP3SL70F780C4LG is a Stratix® III L family Field Programmable Gate Array (FPGA) optimized for balanced mainstream applications that require a combination of logic, on-chip memory, and DSP resources. Built around the Stratix III architecture, this commercial-grade, surface-mount device delivers 67,500 logic elements, approximately 2.7 Mbits of embedded memory, and 488 user I/Os in a 780-ball FCBGA package (29×29).
Designed for high-performance logic, digital signal processing (DSP), and embedded designs, the device provides selectable core voltage and power-management features from the Stratix III family to tune performance and power for your application.
Key Features
- Logic Capacity — 67,500 logic elements provide substantial programmable logic resources for complex combinational and sequential designs.
- Embedded Memory — Approximately 2.7 Mbits of on-chip RAM (2,699,264 total RAM bits) for data buffering, FIFOs, and memory-mapped logic functions.
- DSP and Arithmetic Resources — Stratix III family architecture includes high‑speed DSP blocks and dedicated multipliers for multiply-accumulate and filter implementations (family-level feature).
- I/O Resources — 488 user I/O pins arranged for flexible interfacing and modular I/O bank support.
- Power and Core Voltage — Selectable core voltage capability and Programmable Power Technology (family-level feature) enable tuning between performance and power consumption. Device supply range: 860 mV to 1.15 V.
- Package and Mounting — 780-BBGA (FCBGA) package, supplier device package 780-FBGA (29×29); surface-mount mounting type suitable for automated PCB assembly.
- Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.
- Reliability and Security (Family Features) — Family-level options include configuration memory error detection and optional 256-bit AES configuration bitstream security.
Typical Applications
- High‑Performance Logic — Implement complex state machines, custom processors, and glue logic where large logic capacity and flexible I/O are required.
- Digital Signal Processing (DSP) — Leverage embedded DSP blocks and on-chip memory for FIR filters, FFT pre/post processing, and other signal-processing pipelines.
- Embedded Systems — Integrate peripherals, memory controllers, and custom accelerators for embedded designs that benefit from reprogrammable hardware.
- High‑Speed Interfaces — Use abundant I/O resources and modular I/O bank support to connect external memories and high-speed peripherals (family-level memory-interface support).
Unique Advantages
- Balanced resource mix: 67,500 logic elements and approximately 2.7 Mbits of embedded memory provide a balanced platform for logic, memory, and DSP workloads.
- Flexible power/performance trade-offs: Selectable core voltage and family-level Programmable Power Technology let designers tune the device for either higher performance or lower power consumption.
- Extensive I/O capacity: 488 user I/Os support complex bus attachments and multiple external interfaces without extensive external glue logic.
- Commercial-grade deployment: Rated for 0 °C to 85 °C operation and RoHS compliant, enabling mainstream product integration and regulatory compliance for many markets.
- Proven Stratix III architecture: Family-level features such as dedicated DSP blocks, memory interface support, and configuration security options help accelerate system design and reduce integration risk.
Why Choose EP3SL70F780C4LG?
This Stratix® III L device is positioned for developers who need a versatile, high-capacity FPGA with a balanced combination of logic, embedded memory, and DSP resources. Its selectable core-voltage capability and family-level power-management features make it suitable for designs that must trade off performance and power consumption while maintaining substantial processing and interfacing capability.
EP3SL70F780C4LG is well suited to engineers building complex embedded systems, signal-processing applications, and memory-interfaced designs that require a programmable platform with robust I/O and reliable commercial-grade operation.
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