EP3SL70F780C4

IC FPGA 488 I/O 780FBGA
Part Description

Stratix® III L Field Programmable Gate Array (FPGA) IC 488 2699264 67500 780-BBGA, FCBGA

Quantity 673 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O488Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2700Number of Logic Elements/Cells67500
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2699264

Overview of EP3SL70F780C4 – Stratix® III L FPGA, 780-FBGA (29x29)

The EP3SL70F780C4 is a Stratix® III L Field Programmable Gate Array (FPGA) IC offering high logic density and substantial on-chip memory in a compact FCBGA package. It provides 67,500 logic elements, approximately 2.7 Mbits of embedded memory, and 488 programmable I/O, packaged for surface-mount assembly in a 780-FBGA (29x29) footprint.

Designed for commercial-grade deployment, the device operates from 860 mV to 1.15 V core supply and across a 0 °C to 85 °C operating range, and is RoHS compliant.

Key Features

  • Core Logic  67,500 logic elements for implementing complex digital functions and high-density logic designs.
  • Embedded Memory  Total on-chip RAM of 2,699,264 bits (approximately 2.7 Mbits) to support buffering, lookup tables, and local data storage.
  • I/O Capacity & Packaging  488 general-purpose I/Os in a 780-BBGA FCBGA package (supplier package: 780-FBGA, 29x29) with surface-mount mounting for compact board integration.
  • Power  Core voltage supply range from 860 mV to 1.15 V to match system power-domain requirements.
  • Temperature & Grade  Commercial grade operation with an ambient range of 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant.

Unique Advantages

  • High logic density: 67,500 logic elements enable implementation of large, complex logic blocks on a single device, reducing the need for multiple FPGAs.
  • Substantial on-chip memory: Approximately 2.7 Mbits of embedded RAM provides local storage for buffering and state data, minimizing external memory dependencies.
  • Extensive I/O count: 488 I/Os allow direct connection to many peripherals and subsystems without extensive external I/O expanders.
  • Compact surface-mount FCBGA package: 780-FBGA (29x29) packaging supports high-pin-count designs in a space-efficient footprint for dense PCB layouts.
  • Low-voltage core operation: 860 mV to 1.15 V supply range supports contemporary low-voltage system designs.
  • Commercial-grade and RoHS compliant: Suitable for standard commercial environments while meeting environmental compliance requirements.

Why Choose EP3SL70F780C4?

The EP3SL70F780C4 is positioned for designers who require a high-density, memory-rich FPGA in a compact, surface-mount FBGA package for commercial applications. Its combination of 67,500 logic elements, approximately 2.7 Mbits of embedded RAM, and 488 I/Os offers a balance of logic capacity, on-chip storage, and connectivity that supports complex digital system designs.

Choosing this device provides scalability for sophisticated logic implementations while keeping board space and external component count low. Its specified voltage range, commercial temperature rating, and RoHS compliance make it suitable for production deployments in standard commercial environments.

Request a quote or submit an inquiry today to check pricing and availability for the EP3SL70F780C4.

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