EP3SL70F780C3G

The EP3SL70F780C3G is a Stratix® III L field-programmable gate array (FPGA) in a 780-FBGA (29×29) package designed for commercial applications. Architected for high-performance logic, DSP and memory-centric designs, this device combines a large logic fabric with multi-megabit on-chip memory and a broad set of I/O resources for system integration.

With 67,500 logic elements, approximately 2.7 Mbits of embedded memory, and 488 user I/Os, the device targets demanding applications that require density, flexible I/O and robust system features while operating within a commercial temperature range.

Key Features

• Logic Capacity  67,500 logic elements provide a substantial programmable fabric for complex combinational and sequential logic implementations.
• Embedded Memory  Approximately 2.7 Mbits of on-chip RAM support FIFOs, packet buffers and data-path storage without relying solely on external memory.
• High I/O Count  488 user I/Os arranged for flexible interfacing with external peripherals and memory devices to simplify board-level integration.
• Power and Voltage  Selectable core voltage operation with device supply range from 860 mV to 1.15 V to support different power/performance trade-offs.
• High-speed System Features (series level)  Stratix III family capabilities include dedicated DSP blocks, SERDES support and dynamic I/O features documented for the series that aid high-performance signal processing and communications.
• Security & Reliability (series level)  Series-level features include optional AES encryption for configuration bitstreams and built-in error detection/correction mechanisms to support reliability in deployment.
• Package & Mounting  780-FBGA (29×29) package, surface-mount mounting type—compact, high-density footprint suitable for modern PCBs.
• Commercial Temperature Grade  Specified for operation from 0 °C to 85 °C suitable for commercial and enterprise applications.
• RoHS Compliance  Device is RoHS compliant, supporting regulatory and manufacturing requirements for lead-free assemblies.

Typical Applications

• High-performance DSP and signal processing  Large logic capacity and multi-megabit embedded memory enable implementation of filters, transforms and real-time data paths.
• Networking and communications  Broad I/O count and series-level high-speed I/O features support protocol processing, packet buffering and interface bridging tasks.
• Embedded system integration  Combines programmable logic, on-chip memory and plentiful I/O to consolidate glue logic, peripherals and custom accelerators on a single device.
• Memory interface controllers  Embedded memory plus flexible I/O enables implementation of controllers and FIFOs for external memory subsystems.

Unique Advantages

• Substantial programmable fabric: 67,500 logic elements let you implement complex state machines, datapaths and custom accelerators without partitioning across multiple devices.
• On-chip memory for system efficiency: Approximately 2.7 Mbits of embedded RAM reduce dependence on external memory, lowering BOM and improving latency for buffer-intensive designs.
• Flexible I/O integration: 488 user I/Os provide the pin count and routing flexibility required for multi-interface designs and dense connector requirements.
• Selectable core voltage: Core supply range (860 mV–1.15 V) enables design trade-offs between performance and power to match system priorities.
• Commercial-grade reliability: Specified 0 °C to 85 °C operating range and built-in series-level reliability features help maintain consistent operation in enterprise and commercial deployments.
• Compact, high-density package: 780-FBGA (29×29) surface-mount package supports small form-factor boards while delivering high pin count.

Why Choose EP3SL70F780C3G?

The EP3SL70F780C3G positions itself where sizable programmable logic, multi-megabit embedded memory and extensive I/O converge in a single commercial-grade FPGA package. It is suited to engineers and procurement teams building high-performance DSP, networking, embedded control and memory-interface solutions that require a balance of density and integration.

Choosing this Stratix III L device brings the benefits of a mature device family—programmable power and series-level system features—combined with a compact 780-FBGA package and RoHS compliance, supporting long-term design stability and manufacturability.

Request a quote or submit your purchase inquiry to check availability and lead times for EP3SL70F780C3G and to discuss how this device fits your next design.