EP3SL70F780C4G

The EP3SL70F780C4G is a Stratix® III L family FPGA delivered in a 780-ball FCBGA (29×29) surface-mount package. This commercial-grade, low-voltage FPGA combines high logic capacity, substantial embedded memory, and a broad I/O count for use in high-performance logic, DSP, and embedded system designs.

Engineered for designers who need a balance of logic, memory and multiplier resources, the device supports selectable core voltage operation and a suite of system-level reliability and security features drawn from the Stratix III family.

Key Features

• Logic Capacity — 67,500 logic elements suitable for complex control, processing, and glue-logic implementations.
• Embedded Memory — Approximately 2.7 Mbits of on-chip RAM (2,699,264 bits) to support buffers, FIFOs, and on-chip data storage.
• I/O and Package — 488 user I/O pins in a 780-ball FCBGA (29×29) surface-mount package for dense board integration and flexible I/O assignment.
• Voltage and Thermal — Selectable core voltage operation with supply range of 0.86 V to 1.15 V and commercial operating temperature from 0 °C to 85 °C.
• Programmable Power Technology — Family-level power-management capabilities that enable selective power/performance trade-offs for lower power consumption during partial usage.
• Security and Reliability — Series-level support for optional 256-bit AES encryption of configuration bitstreams and configuration memory error detection (CRC) and error-correction coding (ECC) for TriMatrix memory blocks.
• Advanced Clocking and DSP Support — Series features include up to 12 PLLs, multiple global/regional/peripheral clocks, and high-speed DSP block support for multiplier and MAC operations (as described in the Stratix III handbook).
• Standards and I/O Support — Modular I/O bank architecture and on-chip termination features support a wide range of industry I/O standards and high-speed interface designs (series-level capability).
• RoHS Compliant — Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

• High-performance logic and glue logic — Consolidate complex state machines, protocol bridging, and custom control logic using the device’s 67,500 logic elements and ample I/O.
• Digital signal processing — Implement FIR filters, multipliers, and MACs using the Stratix III family’s DSP block support and embedded RAM for streaming data buffers.
• Embedded systems and soft processors — Host embedded soft-core processors and peripheral logic with on-chip memory and configurable clocking resources for flexible system design.
• High-speed interfaces and memory controllers — Use the device’s modular I/O banks, on-die termination, and clocking resources to support external memory interfaces and communication links.

Unique Advantages

• High logic density: 67,500 logic elements enable complex designs without external glue logic, reducing PCB area and BOM complexity.
• Substantial on-chip RAM: ~2.7 Mbits of embedded memory supports large buffers, FIFOs, and data-path storage for DSP and interface workloads.
• Flexible I/O and package: 488 user I/Os in a compact 780-FBGA (29×29) package allow dense connectivity and board-level routing efficiency.
• Selectable core voltage: Core supply range of 0.86 V to 1.15 V enables trade-offs between performance and power consumption for system-level optimization.
• Built-in reliability and security: Series-level ECC, CRC configuration checks, and optional 256-bit AES encryption help protect configuration integrity and IP.
• Commercial temperature and RoHS compliance: 0 °C to 85 °C operating range and RoHS compliance simplify design choices for commercial applications and lead-free assembly.

Why Choose EP3SL70F780C4G?

The EP3SL70F780C4G positions itself as a versatile, performance-oriented Stratix III L device that brings together high logic capacity, significant embedded memory, and extensive I/O in a compact surface-mount FCBGA package. Its selectable core voltage and family-level power-management features let designers balance performance and power for targeted use cases.

Ideal for teams building high-performance logic, DSP pipelines, or embedded systems that require on-chip memory, programmable clocking, and configuration security, this FPGA offers a proven series feature set and commercial-grade reliability for production designs.

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