EP3SL70F780C4N

The EP3SL70F780C4N is a Stratix® III L Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 780‑FBGA (29×29) surface‑mount package. It provides a high logic capacity device with significant on‑chip memory and a large I/O count for complex digital designs.

This commercial‑grade FPGA targets applications that require large numbers of logic elements, substantial embedded RAM, and flexible I/O — all supported by a core voltage range of 0.86 V to 1.15 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic  67,500 logic elements provide high-density programmable logic for complex designs and custom datapath implementations.
• Embedded Memory  Approximately 2.7 Mbits of on‑chip RAM for buffering, LUTRAM, and state storage without external memory.
• I/O Capacity  488 user I/O pins support extensive peripheral interfacing, parallel buses, and high‑pin‑count designs.
• Package and Mounting  780‑FBGA (29×29) package in a 780‑BBGA form factor; optimized for surface‑mount PCB assembly in compact, high‑density layouts.
• Power  Core supply voltage range of 0.86 V to 1.15 V to match system power rails and FPGA core requirements.
• Temperature Range  Commercial operating range from 0 °C to 85 °C suitable for standard embedded and commercial electronics environments.
• RoHS Compliant  Conforms to RoHS directives for lead‑free manufacturing and environmental compliance.

Typical Applications

• High‑density logic implementations  Use the large logic element count to implement complex state machines, parallel processing blocks, or custom accelerators on a single device.
• Memory‑intensive functions  Leverage approximately 2.7 Mbits of embedded RAM for buffering, packet queues, and intermediate data storage without external SRAM/DRAM.
• Multi‑interface and I/O aggregation  488 I/O pins support integration of multiple peripherals, wide‑data buses, and extensive signal routing for system integration.
• Compact, high‑density PCB designs  The 780‑FBGA package enables high‑pin‑count implementations in space‑constrained boards while maintaining surface‑mount assembly compatibility.

Unique Advantages

• High logic capacity: 67,500 logic elements consolidate large designs into a single programmable device, reducing board count and system complexity.
• Significant on‑chip RAM: Approximately 2.7 Mbits of embedded memory minimizes dependence on external memory components and improves data throughput.
• Extensive I/O availability: 488 user I/Os enable broad interfacing options and simplify integration of multiple subsystems without additional I/O expanders.
• Compact FBGA package: The 780‑FBGA (29×29) package balances pin density with a small PCB footprint to support compact product designs.
• Commercial temperature rating: Specified for 0 °C to 85 °C operation to align with standard commercial electronics deployment scenarios.
• RoHS compliant: Facilitates lead‑free manufacturing and regulatory compliance in commercial products.

Why Choose EP3SL70F780C4N?

The EP3SL70F780C4N delivers a combination of high logic element count, substantial embedded RAM, and a large number of user I/Os in a compact 780‑FBGA surface‑mount package. Its commercial temperature range and RoHS compliance make it suitable for a wide range of standard embedded and commercial electronic systems where integration density and on‑chip memory are priorities.

This FPGA is well suited to engineering teams looking to consolidate complex logic and memory functions onto a single device to reduce BOM complexity and simplify board design, while operating within standard commercial environmental ranges and power rails.

Request a quote or contact sales to discuss availability, pricing, and how EP3SL70F780C4N can fit your next design.