EP3SL70F780C2N

The EP3SL70F780C2N is a Stratix® III L FPGA from Intel offered in a 780-FBGA (29×29) surface-mount package. It delivers a high-density programmable logic fabric with abundant embedded memory and a large number of I/O pins for commercial electronic designs.

With 67,500 logic elements and approximately 2.7 Mbits of on-chip RAM, this device targets applications that require significant logic capacity, embedded memory resources, and extensive external interfacing within a compact FCBGA footprint.

Key Features

• Core Logic  67,500 logic elements provide substantial programmable logic capacity for complex finite state machines, datapaths, and custom logic blocks.
• Embedded Memory  Approximately 2.7 Mbits of on-chip RAM to support buffering, lookup tables, and intermediate data storage without immediate external memory dependency.
• High Pin Count I/O  488 I/O pins enable wide external connectivity for parallel data buses, multiple interfaces, and dense board-level integration.
• Power Supply  Operates from an internal voltage supply range of 0.860 V to 1.15 V to match target core power requirements and design power planning.
• Package & Mounting  780-FBGA (29×29) package in a surface-mount FCBGA form factor for compact PCB placement and thermal conduction through the package.
• Operating Conditions  Commercial-grade device with an operating temperature range of 0 °C to 85 °C, suitable for general-purpose commercial environments.
• Environmental Compliance  RoHS-compliant construction for adherence to common environmental and materials regulations.

Typical Applications

• Commercial Embedded Systems  Use the FPGA to implement custom logic blocks, protocol bridges, and control functions where high logic density and on-chip memory reduce external component count.
• High‑I/O Interface Control  Leverage 488 I/O pins for designs requiring multiple parallel interfaces, board-level signal aggregation, or multi-channel I/O handling.
• Data Buffering and Processing  Apply the device’s embedded memory and logic resources for intermediate data buffering, small-scale packet processing, and lookup-table implementations.

Unique Advantages

• High Logic Density: 67,500 logic elements enable consolidation of complex functions into a single device, simplifying system architecture and reducing board-level components.
• Substantial On‑Chip Memory: Approximately 2.7 Mbits of embedded RAM reduces dependence on external memory for mid-sized buffering and data structure storage.
• Extensive I/O Resources: 488 I/O pins support dense external interfacing and multi-channel connectivity without additional I/O expanders.
• Compact FCBGA Package: The 780-FBGA (29×29) surface-mount package provides a space-efficient solution for high-density PCB layouts.
• Commercial Temperature Rating: Rated 0 °C to 85 °C to match standard commercial deployment environments and product lifecycles.
• Regulatory Compliance: RoHS-compliant construction supports environmentally conscious designs and procurement policies.

Why Choose EP3SL70F780C2N?

The EP3SL70F780C2N delivers a balanced combination of logic capacity, embedded memory, and extensive I/O in a compact 780-FBGA (29×29) package. It is positioned for commercial designs that require substantial programmable logic and on-chip RAM while maintaining a compact board footprint.

This Intel-manufactured Stratix® III L FPGA is suitable for engineers and procurement teams implementing mid-to-high density programmable systems who need predictable operating conditions, RoHS compliance, and a clearly defined power and temperature envelope.

Request a quote or submit an inquiry for pricing and availability of EP3SL70F780C2N to move your design forward.