EP3SL70F484I4LN

The EP3SL70F484I4LN is a Stratix® III L Field Programmable Gate Array (FPGA) supplied in a 484-BBGA FCBGA package. It delivers a high-density programmable logic fabric with 67,500 logic elements and approximately 2.7 Mbits of on-chip RAM.

With 296 user I/Os, an industrial-grade operating range of -40 °C to 100 °C, and a core supply range of 860 mV to 1.15 V, this device is specified for designs that require substantial logic capacity, significant embedded memory, and broad I/O in a compact surface-mount form factor.

Key Features

• Core Logic 
  67,500 logic elements provide capacity for complex programmable-logic implementations and parallel processing architectures.
• Embedded Memory 
  Approximately 2.7 Mbits of on-chip RAM for buffering, lookup tables, and local storage, reducing dependence on external memory in many use cases.
• I/O Capability 
  296 user I/Os facilitate extensive interfacing with sensors, peripherals, and external logic.
• Power Supply 
  Core voltage range from 860 mV to 1.15 V to match system-level power domains.
• Package and Mounting 
  484-BBGA (FCBGA) package with supplier device package 484-FBGA (23×23); surface-mount mounting type supports compact board layouts.
• Temperature and Grade 
  Industrial-grade device rated for operation from -40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance 
  RoHS compliant for lead-free assembly and regulatory conformity.

Typical Applications

• Industrial Control 
  Deploy programmable logic and extensive I/O in automation and control systems that require industrial temperature support and robust operation.
• High-Density Logic Integration 
  Use the device’s 67,500 logic elements and ~2.7 Mbits RAM to implement complex state machines, data processing pipelines, or custom hardware accelerators.
• I/O-Intensive Systems 
  Leverage 296 user I/Os for sensor aggregation, multi-protocol interfacing, and peripheral management without extensive external glue logic.

Unique Advantages

• High Logic Density: 67,500 logic elements enable implementation of sophisticated logic and parallel processing within a single device.
• Substantial On-Chip Memory: Approximately 2.7 Mbits of embedded RAM supports large local buffers, FIFOs, and lookup tables to improve data throughput.
• Large I/O Count: 296 user I/Os reduce the need for additional I/O expanders and simplify board-level integration.
• Industrial Temperature Range: Rated for -40 °C to 100 °C operation for reliable performance in demanding environments.
• Compact Surface-Mount Package: 484-BBGA (23×23) FCBGA package offers a space-efficient solution for high-density designs.
• RoHS Compliant: Meets environmental requirements for lead-free manufacturing processes.

Why Choose EP3SL70F484I4LN?

The EP3SL70F484I4LN positions itself as a high-capacity Stratix® III L FPGA option that balances large programmable logic resources, meaningful on-chip memory, and extensive I/O in a compact FCBGA package. Its industrial-grade temperature rating and RoHS compliance make it suitable for robust, production-level deployments.

Engineers and procurement teams seeking a single-device solution for dense logic integration, significant embedded memory, and broad external interfacing will find this part well suited to industrial and embedded designs that demand dependable operation across temperature extremes.

Request a quote or submit an inquiry for EP3SL70F484I4LN to receive pricing and availability information tailored to your project requirements.