EP3SL70F484I4G

IC FPGA 296 I/O 484FBGA
Part Description

Stratix® III L Field Programmable Gate Array (FPGA) IC 296 2699264 67500 484-BBGA, FCBGA

Quantity 375 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGA, FCBGANumber of I/O296Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2700Number of Logic Elements/Cells67500
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits2699264

Overview of EP3SL70F484I4G – Stratix® III L Field Programmable Gate Array (FPGA), 67,500 logic elements, 296 I/O, 484-FBGA

The EP3SL70F484I4G is a Stratix® III L family FPGA offering 67,500 logic elements and approximately 2.7 Mbits of embedded memory. Built for high-performance, programmable logic and DSP-centric designs, this industrial-grade device provides flexible I/O and power options for mainstream and performance-driven applications.

As a member of the Stratix III L family, the device leverages family-level features such as selectable core voltage and power-management architecture to balance performance and power consumption while supporting advanced system integration requirements.

Key Features

  • Logic Capacity — 67,500 logic elements to implement complex combinational and sequential logic functions for mid- to high-density designs.
  • Embedded Memory — Approximately 2.7 Mbits of on-chip RAM for frame buffering, FIFOs, and embedded data storage.
  • DSP and Multiply Resources — Family-level DSP blocks and high-speed multipliers support demanding signal processing and arithmetic workloads.
  • I/O and Packaging — 296 user I/O pins in a 484-BBGA (484-FBGA, 23×23) surface-mount package, enabling broad interface options and compact board-level integration.
  • Voltage and Power — Selectable core voltage operation over a supply range of 860 mV to 1.15 V to tune performance versus power consumption.
  • Clocks and PLLs — Family-level support for multiple global and regional clocks and up to 12 PLLs for flexible clocking architectures.
  • Security and Reliability — Family features include optional 256-bit AES configuration encryption, CRC-based configuration error detection, and ECC support for embedded memory to improve system robustness.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • Standards and Interfaces — Family support for high-speed SERDES, dynamic on-chip termination, and memory interface features for DDR, DDR2, DDR3 and other external memories.
  • Regulatory — RoHS compliant.

Typical Applications

  • Telecommunications & Networking — Packet processing, protocol bridging, and high-speed interface logic where dense logic and flexible I/O are required.
  • Signal Processing & DSP Systems — Real-time filtering, channel processing, and accelerator functions leveraging on-chip DSP resources and embedded memory.
  • Memory Interface Controllers — Controllers and interface logic for external DDR/DDR2/DDR3 and other high-speed memories using dedicated I/O features and DQS support.
  • Embedded and High-Performance Systems — Custom control, data-path acceleration, and system orchestration with support for embedded processor integration and multiple clock domains.

Unique Advantages

  • High integration density: 67,500 logic elements and substantial on-chip RAM reduce external components and simplify board-level design.
  • Flexible power/performance trade-off: Selectable core voltage (860 mV–1.15 V) enables designers to tune device performance against power consumption.
  • Robust I/O and packaging: 296 user I/O in a compact 484-FBGA footprint supports diverse interfaces while conserving PCB area.
  • Security and mission-critical features: Built-in AES key support, configuration CRC, and ECC for memory enhance system-level reliability and protection.
  • Industrial-ready operation: −40 °C to 100 °C rating and RoHS compliance suit deployment in industrial environments with stringent operating conditions.
  • Scalable system integration: Multiple PLLs and abundant clock resources simplify complex timing architectures and multi-domain designs.

Why Choose EP3SL70F484I4G?

The EP3SL70F484I4G positions itself as a versatile Stratix III L FPGA for designers who need substantial logic capacity, embedded memory, and industrial operating range in a compact BGA package. Its family-level power-management features and selectable core voltage provide practical levers to balance throughput and power.

This device is well suited for engineers developing telecommunications, DSP, and high-performance embedded systems that require a combination of logic density, configurable I/O, and built-in reliability and security features backed by the Stratix III device family capabilities.

Request a quote or submit an inquiry to receive pricing and availability information for the EP3SL70F484I4G and to start your procurement process.

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