EP3SL70F484I4G
| Part Description |
Stratix® III L Field Programmable Gate Array (FPGA) IC 296 2699264 67500 484-BBGA, FCBGA |
|---|---|
| Quantity | 375 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA, FCBGA | Number of I/O | 296 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2700 | Number of Logic Elements/Cells | 67500 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 2699264 |
Overview of EP3SL70F484I4G – Stratix® III L Field Programmable Gate Array (FPGA), 67,500 logic elements, 296 I/O, 484-FBGA
The EP3SL70F484I4G is a Stratix® III L family FPGA offering 67,500 logic elements and approximately 2.7 Mbits of embedded memory. Built for high-performance, programmable logic and DSP-centric designs, this industrial-grade device provides flexible I/O and power options for mainstream and performance-driven applications.
As a member of the Stratix III L family, the device leverages family-level features such as selectable core voltage and power-management architecture to balance performance and power consumption while supporting advanced system integration requirements.
Key Features
- Logic Capacity — 67,500 logic elements to implement complex combinational and sequential logic functions for mid- to high-density designs.
- Embedded Memory — Approximately 2.7 Mbits of on-chip RAM for frame buffering, FIFOs, and embedded data storage.
- DSP and Multiply Resources — Family-level DSP blocks and high-speed multipliers support demanding signal processing and arithmetic workloads.
- I/O and Packaging — 296 user I/O pins in a 484-BBGA (484-FBGA, 23×23) surface-mount package, enabling broad interface options and compact board-level integration.
- Voltage and Power — Selectable core voltage operation over a supply range of 860 mV to 1.15 V to tune performance versus power consumption.
- Clocks and PLLs — Family-level support for multiple global and regional clocks and up to 12 PLLs for flexible clocking architectures.
- Security and Reliability — Family features include optional 256-bit AES configuration encryption, CRC-based configuration error detection, and ECC support for embedded memory to improve system robustness.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
- Standards and Interfaces — Family support for high-speed SERDES, dynamic on-chip termination, and memory interface features for DDR, DDR2, DDR3 and other external memories.
- Regulatory — RoHS compliant.
Typical Applications
- Telecommunications & Networking — Packet processing, protocol bridging, and high-speed interface logic where dense logic and flexible I/O are required.
- Signal Processing & DSP Systems — Real-time filtering, channel processing, and accelerator functions leveraging on-chip DSP resources and embedded memory.
- Memory Interface Controllers — Controllers and interface logic for external DDR/DDR2/DDR3 and other high-speed memories using dedicated I/O features and DQS support.
- Embedded and High-Performance Systems — Custom control, data-path acceleration, and system orchestration with support for embedded processor integration and multiple clock domains.
Unique Advantages
- High integration density: 67,500 logic elements and substantial on-chip RAM reduce external components and simplify board-level design.
- Flexible power/performance trade-off: Selectable core voltage (860 mV–1.15 V) enables designers to tune device performance against power consumption.
- Robust I/O and packaging: 296 user I/O in a compact 484-FBGA footprint supports diverse interfaces while conserving PCB area.
- Security and mission-critical features: Built-in AES key support, configuration CRC, and ECC for memory enhance system-level reliability and protection.
- Industrial-ready operation: −40 °C to 100 °C rating and RoHS compliance suit deployment in industrial environments with stringent operating conditions.
- Scalable system integration: Multiple PLLs and abundant clock resources simplify complex timing architectures and multi-domain designs.
Why Choose EP3SL70F484I4G?
The EP3SL70F484I4G positions itself as a versatile Stratix III L FPGA for designers who need substantial logic capacity, embedded memory, and industrial operating range in a compact BGA package. Its family-level power-management features and selectable core voltage provide practical levers to balance throughput and power.
This device is well suited for engineers developing telecommunications, DSP, and high-performance embedded systems that require a combination of logic density, configurable I/O, and built-in reliability and security features backed by the Stratix III device family capabilities.
Request a quote or submit an inquiry to receive pricing and availability information for the EP3SL70F484I4G and to start your procurement process.

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