EP3SL70F484I3N

The EP3SL70F484I3N is a Stratix® III L field programmable gate array (FPGA) from Intel, offering a large logic fabric and substantial on-chip memory in a 484-ball FBGA package. With 67,500 logic elements, approximately 2.7 Mbits of embedded RAM, and 296 I/Os, it is designed for complex digital designs that require significant logic and memory integration within an industrial-grade device.

Its surface-mount 484-FBGA (23×23) package, wide core voltage range (0.86–1.15 V), and operating temperature range of −40 °C to 100 °C make it suitable for industrial applications that demand robust thermal and power characteristics.

Key Features

• Logic Capacity — 67,500 logic elements provide extensive programmable resources for implementing complex combinational and sequential logic functions.
• Embedded Memory — Approximately 2.7 Mbits of on-chip RAM support buffering, FIFOs, and local data storage for high-throughput designs.
• I/O Resources — 296 I/O pins enable broad peripheral and interface connectivity for multi-channel systems and board-level integration.
• Package and Mounting — Supplied in a 484-BBGA / FCBGA surface-mount package (supplier device package: 484-FBGA, 23×23) for compact board-level deployment.
• Power — Core voltage range of 0.86 V to 1.15 V supports system power planning and compatibility with varied power domains.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet temperature demands of industrial environments.
• RoHS Compliant — Conforms to RoHS requirements for lead-free manufacturing and environmental compliance.

Typical Applications

• Industrial Control — Use the FPGA for motor control, PLC interfaces, and rugged control systems where industrial temperature range and reliable I/O counts are required.
• Signal Processing — Leverage the large logic capacity and embedded RAM for data-path implementations, filtering, and real-time processing pipelines.
• Communications Infrastructure — Implement protocol processing, frame handling, and custom interfaces using the abundant logic and 296 I/Os.
• Custom Embedded Systems — Integrate multiple functions on-chip—reducing external components—thanks to extensive logic and memory resources in a compact FBGA package.

Unique Advantages

• High Logic Density: 67,500 logic elements offer a large programmable fabric for complex designs, minimizing the need for multiple devices.
• Substantial On-Chip Memory: Approximately 2.7 Mbits of embedded RAM enable local buffering and state retention without adding external memory.
• Generous I/O Count: 296 I/Os provide flexibility for multi-channel interfaces, peripheral expansion, and board-level routing options.
• Industrial-Grade Temperature Range: Rated from −40 °C to 100 °C to support deployment in industrial and temperature-demanding environments.
• Compact, Surface-Mount Package: The 484-FBGA (23×23) package allows high-density PCB layouts while maintaining thermal and mechanical stability.
• Wide Core Voltage Window: 0.86–1.15 V core supply range supports varied power architectures and supply planning.

Why Choose EP3SL70F484I3N?

The EP3SL70F484I3N positions itself as a high-capacity, industrial-grade Stratix® III L FPGA suitable for engineers building complex, on-chip integrated solutions that require extensive logic, embedded memory, and a large I/O complement. Its package and electrical characteristics support compact system designs with defined thermal and power constraints.

Backed by Intel as the manufacturer and offering RoHS compliance, this device is appropriate for long-lived industrial applications where predictable electrical and thermal behavior are important. It is a strong choice for projects that need scalable programmable logic, significant local memory, and robust operating temperature performance.

Request a quote or submit a pricing inquiry to evaluate EP3SL70F484I3N for your next design and confirm availability and lead times.