EP3SL70F484C4LN

The EP3SL70F484C4LN is a Stratix® III L Field Programmable Gate Array (FPGA) from Intel, offered in a 484‑ball BGA/FCBGA package. It provides a large logic fabric, substantial on‑chip memory, and a dense I/O complement for designs that require significant programmable logic and embedded memory resources within a compact surface‑mount package.

This commercial‑grade FPGA is well suited to applications that need high logic capacity combined with abundant embedded RAM and flexible I/O count while operating within standard commercial temperature and supply ranges.

Key Features

• Logic Capacity — 67,500 logic elements to support complex digital implementations and large programmable designs.
• Embedded Memory — Approximately 2.7 Mbits of on‑chip RAM (2,699,264 bits) for buffering, FIFOs, and embedded data storage.
• I/O Density — 296 I/O pins providing broad external connectivity for peripherals, buses, and external memory interfaces.
• Power — Core supply range of 860 mV to 1.15 V to match common FPGA power architectures.
• Package and Mounting — 484‑ball BGA / FCBGA package (supplier device package: 484‑FBGA, 23×23) with surface‑mount mounting for compact board-level integration.
• Operating Range — Commercial operating temperature from 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• High‑density digital systems — Use the large logic capacity and on‑chip RAM to implement complex glue logic, protocol bridges, and custom datapaths.
• Signal processing and buffering — Approximately 2.7 Mbits of embedded memory supports local buffering and streaming data manipulation in FPGA‑based signal chains.
• Embedded control and interface logic — 296 I/Os enable consolidation of multiple peripheral interfaces and board‑level control functions into a single device.
• Prototyping and product development — Commercial temperature grade and surface‑mount BGA package make the device suitable for development and production environments targeting standard commercial applications.

Unique Advantages

• Large programmable fabric: 67,500 logic elements provide capacity for complex algorithm implementation and wide parallelism.
• Substantial embedded memory: Approximately 2.7 Mbits of on‑chip RAM reduces external memory dependency for many buffering and data‑path needs.
• Generous I/O count: 296 I/Os simplify integration with multiple peripherals and external subsystems without extensive multiplexing.
• Compact board footprint: 484‑ball BGA/FCBGA package in a 23×23 ball array supports high‑density PCB designs.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to meet standard commercial deployment requirements.
• RoHS compliant: Meets environmental compliance expectations for commercial electronics manufacturing.

Why Choose EP3SL70F484C4LN?

The EP3SL70F484C4LN combines a sizable logic element count, ample embedded memory, and a dense I/O complement in a compact 484‑ball BGA/FCBGA package, making it a practical choice for designers who need significant on‑chip resources without resorting to multiple devices. Its commercial temperature rating and RoHS compliance align it with standard production environments.

This FPGA suits teams building complex digital systems, embedded controllers, and data‑buffering applications that require robust logic and memory resources in a surface‑mount package. The device provides a clear upgrade path for designs that prioritize logic capacity, embedded RAM, and broad I/O integration.

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