EP3SL70F484C4G

The EP3SL70F484C4G is a Stratix® III L FPGA in a 484‑FBGA (23×23) FCBGA package, offering a high‑density, configurable fabric for performance‑focused applications. It provides 67,500 logic elements and approximately 2.7 Mbits of embedded RAM, making it suitable for designs that require significant logic capacity, on‑chip memory, and high‑speed I/O integration.

Built on the Stratix III device architecture, this commercial‑grade, RoHS‑compliant device combines selectable core voltage and power management features with integrated DSP and SERDES capabilities to address demanding logic, DSP and memory interface applications within the 0 °C to 85 °C operating range.

Key Features

• Logic Capacity — 67,500 logic elements to implement complex state machines, datapaths, and custom logic functions.
• Embedded Memory — Approximately 2.7 Mbits of on‑chip RAM to support buffering, FIFOs, and local data storage.
• I/O and Packaging — 296 user I/O pins in a 484‑BBGA (FCBGA) surface‑mount package (23×23) for compact board integration and broad I/O connectivity.
• Power and Core Voltage — Selectable core voltage operation with a supply range of 860 mV to 1.15 V and Altera Programmable Power Technology described for the Stratix III family.
• High‑Speed I/O and SERDES — Family support for high‑speed differential I/O with SERDES and dynamic phase alignment for up to 1.6 Gbps signaling; modular I/O banks and dynamic on‑chip termination for improved signal integrity.
• DSP and Multiplier Blocks — Dedicated DSP multipliers (9×9, 12×12, 18×18, 36×36) with documented operation up to 550 MHz for high‑throughput arithmetic and filtering tasks.
• Clocking and PLLs — Family support for up to 16 global clocks, multiple regional and peripheral clocks, and up to 12 PLLs per device for flexible clock synthesis and management.
• Security and Reliability — Family features include optional 256‑bit AES configuration encryption and configuration memory error detection circuitry, as documented in the Stratix III device handbook.
• Commercial Grade and RoHS Compliant — Designed for commercial temperature operation (0 °C to 85 °C) and compliant with RoHS requirements.

Typical Applications

• High‑Performance Logic and DSP — Implementation of complex datapaths, FIR filters, and multiply‑accumulate functions using on‑chip DSP multipliers and abundant logic elements.
• Memory Interface Controllers — Support for external memory interfaces through modular I/O and dedicated DQS logic, suitable for DDR, DDR2, DDR3 and other high‑speed memory topologies documented for the family.
• Networking and Communications — High‑speed differential I/O, SERDES, and dynamic phase alignment enable protocol processing and packet handling in networking and telecom equipment.
• Embedded Systems and Custom Accelerators — On‑chip RAM and configurable logic make the device suitable for custom accelerators, protocol offload, and embedded processing tasks.

Unique Advantages

• Substantial Logic and Memory in One Device: 67,500 logic elements combined with approximately 2.7 Mbits of embedded RAM reduce external component needs and simplify board design.
• Flexible, High‑Speed I/O: 296 user I/Os in a compact 484‑FBGA package with modular I/O banks and dynamic on‑chip termination enhances signal integrity for high‑speed interfaces.
• Built‑In DSP Acceleration: Dedicated multiplier blocks and DSP resources accelerate compute‑intensive tasks without offloading to external processors.
• Configurable Power and Voltage Options: Selectable core voltage and family power management features enable tuning for performance versus power tradeoffs in the design.
• Configuration Security and Reliability: Family‑level support for 256‑bit AES encryption and configuration error detection helps protect bitstreams and improve system availability.

Why Choose EP3SL70F484C4G?

The EP3SL70F484C4G positions itself as a high‑capacity Stratix III L FPGA that balances logic density, embedded memory, and high‑speed I/O in a single commercial‑grade package. Its combination of 67,500 logic elements, substantial on‑chip RAM, SERDES‑capable I/O, and family features such as selectable core voltage and DSP multipliers makes it appropriate for system designers tackling performance‑driven logic, DSP, and memory‑interface applications.

Choosing this device provides scalability within the Stratix III family and access to documented family features for clocking, PLLs, security, and reliability—delivering a robust platform for integration into demanding embedded and communications systems.

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