EP3SL70F484C4LG

The EP3SL70F484C4LG is a Stratix® III L field-programmable gate array (FPGA) delivered in a 484-FBGA (23×23) package for surface-mount assembly. Built on the Stratix III architecture, this device targets high-performance logic, DSP and embedded designs that require substantial logic capacity, on-chip memory and flexible I/O.

With 67,500 logic elements, approximately 2.7 Mbits of embedded memory, and 296 general-purpose I/O pins, the device supports complex algorithms, high-throughput data paths and modular interfacing while operating across a selectable core-voltage window to balance performance and power.

Key Features

• Logic Capacity — 67,500 logic elements suitable for sizeable high-performance designs and complex control or signal-processing functions.
• Embedded Memory — Approximately 2.7 Mbits of on-chip RAM for buffering, FIFOs and local data storage to support data-centric and streaming applications.
• I/O and Packaging — 296 user I/O pins in a 484-FBGA (23×23) surface-mount package, enabling flexible board-level routing and modular I/O bank partitioning.
• Power and Voltage — Selectable core-voltage support with an operating supply range of 860 mV to 1.15 V to trade off performance and power according to system needs.
• Operating Range & Grade — Commercial grade device rated for 0 °C to 85 °C operation and RoHS compliant.
• Stratix III Family Capabilities — Family-level features include Programmable Power Technology, dedicated DSP multipliers, advanced clocking including multiple global and regional clocks, and optional AES 256-bit configuration security.
• Reliability and Error Protection — Family features include configuration memory error detection and ECC support for on-chip memory blocks to enhance system availability.

Typical Applications

• High-Performance DSP — Implement FIR filters, multiply-accumulate pipelines and other signal-processing chains using the device’s logic density and family DSP resources.
• Network and Communications — Support protocol processing, packet handling and high-speed interfacing with available I/O and modular bank architecture.
• Memory Controllers and Interfaces — Use the device’s embedded RAM and I/O to implement DDR/DDR2/DDR3 and other external-memory interfaces at the system level.
• Embedded Systems and Custom Logic — Replace or augment ASIC functions with programmable logic and on-chip memory for rapid differentiation and iterative development.

Unique Advantages

• High Logic Density: 67,500 logic elements provide headroom for complex control, data-path and algorithm implementation, reducing the need for external glue logic.
• Substantial On-Chip Memory: Approximately 2.7 Mbits of embedded RAM enables local buffering and low-latency storage for streaming and packetized data flows.
• Flexible Power/Performance Tradeoffs: Selectable core-voltage support (860 mV to 1.15 V) lets designers balance throughput and power consumption on a per-design basis.
• Broad System Integration: 296 user I/O in a compact 484-FBGA package supports diverse interface standards and simplifies board-level integration.
• Security and Reliability Options: Family-level support for AES 256-bit configuration encryption and ECC/error-detection features helps protect IP and enhance uptime.
• Proven Architecture: Stratix III family features such as configurable PLLs, multiple clock domains and integrated DSP blocks simplify implementation of timing-critical and compute-intensive subsystems.

Why Choose EP3SL70F484C4LG?

The EP3SL70F484C4LG combines ample logic resources, significant embedded memory and a flexible I/O count in a compact 484-FBGA package, making it well suited for high-performance signal processing, communications, and complex embedded systems. Its selectable core-voltage capability and family-level power-management features allow designers to optimize for power or performance as project requirements evolve.

This device is a solid option for engineering teams seeking a scalable, reconfigurable solution with built-in support for advanced clocking, DSP functions and configuration security. It offers the integration and architectural features needed for demanding designs while fitting into commercial-temperature applications.

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