EP3SL70F484C4N

IC FPGA 296 I/O 484FBGA
Part Description

Stratix® III L Field Programmable Gate Array (FPGA) IC 296 2699264 67500 484-BBGA, FCBGA

Quantity 248 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGA, FCBGANumber of I/O296Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2700Number of Logic Elements/Cells67500
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2699264

Overview of EP3SL70F484C4N – Stratix® III L FPGA, 67,500 logic elements, 484-FBGA

The EP3SL70F484C4N is a Stratix® III L Field Programmable Gate Array (FPGA) offered in a 484-ball FCBGA package for surface-mount applications. It provides a high-density programmable logic fabric with 67,500 logic elements, approximately 2.7 Mbits of embedded memory, and up to 296 I/O pins in a 484-FBGA (23×23) footprint.

Designed for commercial electronic designs, this device supports low-voltage core operation (0.86 V to 1.15 V) and a commercial operating temperature range of 0 °C to 85 °C, enabling compact, high-integration solutions where board space and I/O capacity are important.

Key Features

  • Core Logic  67,500 logic elements provide substantial programmable logic capacity for complex designs.
  • Embedded Memory  Approximately 2.7 Mbits of on-chip RAM to support buffering, packet processing, or local data storage needs.
  • I/O Density  Up to 296 user I/O pins to support a wide range of peripheral interfaces and high-pin-count system designs.
  • Package and Mounting  484-ball BGA (FCBGA) package, supplier device package 484-FBGA (23×23), optimized for surface-mount assembly in compact PCBs.
  • Power  Core voltage supply range from 860 mV to 1.15 V to match low-voltage system power rails.
  • Operating Range  Commercial grade operation from 0 °C to 85 °C for standard commercial environments.
  • Compliance  RoHS compliant, supporting environmentally conscious product design and manufacturing.

Unique Advantages

  • High logic density: 67,500 logic elements enable integration of complex functions into a single device, reducing component count and board complexity.
  • Substantial on-chip memory: Approximately 2.7 Mbits of embedded RAM supports local buffering and state storage without external memory.
  • Extensive I/O capacity: 296 I/Os accommodate multiple parallel interfaces and high-pin-count peripherals for flexible system integration.
  • Compact BGA footprint: The 484-FBGA (23×23) package provides a space-efficient form factor suitable for dense PCB layouts.
  • Low-voltage core operation: Broad core supply range (0.86 V–1.15 V) helps align the FPGA with modern low-voltage power architectures.
  • Commercial temperature rating: Specified operation from 0 °C to 85 °C for mainstream commercial product deployments.

Why Choose EP3SL70F484C4N?

The EP3SL70F484C4N positions itself as a high-density, commercially graded FPGA for designs that require substantial logic resources, on-chip memory, and a large number of I/Os in a compact surface-mount package. Its combination of 67,500 logic elements, approximately 2.7 Mbits of embedded RAM, and 296 I/Os makes it suitable for consolidating multiple functions into a single programmable device.

For engineering teams targeting commercial electronic products that demand integration, I/O flexibility, and a compact BGA footprint, this Stratix® III L FPGA offers a balanced set of capabilities and compliance (RoHS) that align with typical production requirements.

Request a quote or submit requirements to receive pricing and availability for the EP3SL70F484C4N. Our team will provide the details you need to move your design forward.

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