EP3SL70F484I4

The EP3SL70F484I4 is a Stratix® III L field programmable gate array (FPGA) supplied in a 484-ball FCBGA package. It provides a high-density, reconfigurable logic fabric with 67,500 logic elements, approximately 2.7 Mbits of embedded memory, and 296 user I/Os for designs that require significant on-chip logic and I/O capacity.

With support for a core supply range of 860 mV to 1.15 V, industrial operating temperature from −40 °C to 100 °C, and a surface-mount 484‑FBGA (23×23) package, this device targets industrial and rugged embedded systems requiring scalable programmable logic and substantial embedded RAM.

Key Features

• Logic Capacity  67,500 logic elements to implement complex custom digital logic and wide datapath designs.
• Embedded Memory  Approximately 2.7 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• I/O Resources  296 user I/Os to interface directly with sensors, peripherals, and system buses.
• Power Supply  Core voltage range of 860 mV to 1.15 V for compatibility with system power rails.
• Package & Mounting  484‑BBGA (FCBGA) surface-mount package, supplier device package 484‑FBGA (23×23), suitable for compact board designs.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Implement custom control logic, state machines, and real-time interfacing for factory automation and process control systems.
• Data Acquisition  Handle multi-channel I/O aggregation and local buffering with on-chip RAM for sensor and measurement systems.
• Prototyping and Development  Rapidly implement and iterate complex digital designs that require significant logic and memory resources.

Unique Advantages

• High Logic Density: 67,500 logic elements allow consolidation of multiple functions into a single device, reducing board complexity.
• Substantial On‑Chip Memory: Approximately 2.7 Mbits of embedded RAM lowers reliance on external memory, simplifying BOM and improving latency.
• Extensive I/O Count: 296 I/Os enable broad peripheral connectivity and flexible interfacing without large external I/O expanders.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in temperature-challenging deployments.
• Compact Surface‑Mount Package: 484‑BBGA/FBGA footprint supports high-density PCB layouts while retaining robust signal routing options.
• RoHS Compliant: Meets lead-free and other material requirements for environmentally conscious manufacturing.

Why Choose EP3SL70F484I4?

The EP3SL70F484I4 positions itself as a scalable, high-capacity FPGA option for engineers needing substantial logic and embedded RAM within an industrial-grade package. Its combination of 67,500 logic elements, approximately 2.7 Mbits of on-chip memory, and nearly 300 I/Os makes it suitable for compact, I/O-intense designs that must operate across extended temperature ranges.

This device is well suited to teams looking to reduce external component count, consolidate functions onto a single programmable device, and maintain flexibility for iterative development. The package and electrical specifications support integration into robust embedded systems where long-term availability and consistent operation matter.

Request a quote or submit an inquiry to receive pricing and availability for EP3SL70F484I4.