EP3SL70F484C4

The EP3SL70F484C4 is a Stratix® III L Field Programmable Gate Array (FPGA) from Intel, offered in a 484-BBGA FCBGA package. It provides high logic density and on-chip memory in a commercial-grade FPGA for board-level surface-mount integration.

With 67,500 logic elements, approximately 2.7 Mbits of embedded memory, and 296 I/Os, this device targets designs that require substantial programmable logic, significant I/O connectivity, and a compact 484-FBGA (23×23) package. It operates over a supply range of 860 mV to 1.15 V and a commercial temperature range of 0°C to 85°C.

Key Features

• Core Logic Capacity  67,500 logic elements to implement complex custom logic and digital functions.
• Embedded Memory  Approximately 2.7 Mbits of on-chip RAM for buffering, state storage, and local data processing.
• I/O Density  296 I/Os to support multiple interfaces, parallel buses, and extensive external connectivity.
• Power Supply  Operates from 860 mV to 1.15 V, providing the defined core voltage range for system design.
• Package & Mounting  484-BBGA, FCBGA (supplier package 484-FBGA, 23×23) in a surface-mount form factor for compact board layouts.
• Operating Grade & Temperature  Commercial grade with an operating temperature range of 0°C to 85°C.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing requirements.

Typical Applications

• High-density logic designs  For implementations that require the capacity of 67,500 logic elements and sizable on-chip RAM to realize complex state machines and custom datapaths.
• I/O-intensive systems  Suitable where 296 I/Os are needed to interface with multiple peripherals, external memories, or parallel data streams.
• Commercial embedded systems  Appropriate for commercial-temperature applications requiring a 0°C to 85°C operating range and RoHS compliance.
• Compact board-level solutions  The 484-FBGA (23×23) surface-mount package enables dense PCB layouts while retaining high integration.

Unique Advantages

• High logic integration: 67,500 logic elements let designers consolidate complex functions into a single device, reducing component count.
• Substantial on-chip memory: Approximately 2.7 Mbits of embedded RAM supports local buffering and state retention without external memory.
• Extensive I/O capability: 296 I/Os provide flexibility for multiple interfaces and parallel connectivity options.
• Compact FCBGA package: The 484-FBGA (23×23) surface-mount package supports high-density PCB implementations and simplified board routing.
• Defined operating conditions: Commercial-grade temperature range (0°C to 85°C) and a clear supply voltage window (860 mV–1.15 V) simplify system-level design and verification.
• RoHS compliant: Meets environmental regulatory requirements for lead-free assembly.

Why Choose EP3SL70F484C4?

EP3SL70F484C4 from Intel combines a high logic-element count, significant on-chip memory, and a large I/O complement in a compact 484-FBGA surface-mount package. These characteristics make it well suited for commercial designs that need substantial programmable logic and dense connectivity while maintaining a predictable operating voltage and temperature range.

Engineers and procurement teams looking for a commercially graded FPGA with clear electrical and mechanical specifications will find this device appropriate for consolidating complex functions, reducing BOM count, and enabling compact board layouts.

Request a quote or submit a purchase inquiry to receive pricing and availability for EP3SL70F484C4.