EP3SL70F484C2N

The EP3SL70F484C2N is a Stratix® III L field programmable gate array (FPGA) in a 484-ball BGA (FCBGA) package manufactured by Intel. It integrates a high count of programmable logic elements, embedded memory, and a large I/O complement to support complex digital designs.

This commercial-grade, surface-mount device targets applications that require substantial on-chip logic capacity and flexible I/O while operating within a typical commercial temperature range.

Key Features

• Core Logic  Approximately 67,500 logic elements provide substantial programmable logic capacity for implementing complex functions and custom datapaths.
• Embedded Memory  Approximately 2.7 Mbits of on-chip RAM (2,699,264 total RAM bits) for buffering, FIFOs, and intermediate storage without external memory in many use cases.
• I/O Resources  296 I/O pins accommodate multiple interfaces, parallel buses, and mixed-signal front-end connections requiring numerous external signals.
• Package & Mounting  484-BBGA (supplier package: 484-FBGA, 23×23) in a surface-mount FCBGA footprint suitable for board-level assembly in compact form factors.
• Power  Core supply voltage range from 860 mV to 1.15 V enables compatibility with specified system power rails and power management schemes.
• Operating Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial-environment deployments.
• Compliance  RoHS-compliant manufacturing status.

Typical Applications

• High-density digital processing  Use the device to implement complex logic blocks, state machines, and custom hardware accelerators where tens of thousands of logic elements are required.
• Embedded memory buffering  Leverage approximately 2.7 Mbits of on-chip RAM for data buffering, packet FIFOs, and intermediate storage to reduce external memory needs.
• I/O-rich interface control  The 296 I/O pins support multi-channel interfaces, bridging between buses, or connecting multiple peripherals and sensors on a single FPGA.
• Compact system integration  The 484-BBGA surface-mount package suits compact PCBs where a high-density, board-mounted FPGA is required.

Unique Advantages

• Substantial logic capacity: Approximately 67,500 logic elements enable implementation of large-scale custom logic without immediate upgrades to external logic devices.
• On-chip memory resources: About 2.7 Mbits of embedded RAM reduce dependence on external memory for many buffering and storage tasks, simplifying BOM and layout.
• Generous I/O count: 296 I/Os allow extensive peripheral connectivity and parallel data paths on a single device.
• Compact FCBGA footprint: The 484-BBGA (23×23) package balances high integration with a board-friendly surface-mount format for dense system designs.
• Commercial temperature suitability: Rated for 0 °C to 85 °C, appropriate for standard commercial electronics deployments.
• RoHS-compliant: Meets RoHS requirements to support environmentally conscious manufacturing processes.

Why Choose EP3SL70F484C2N?

The EP3SL70F484C2N positions itself as a high-capacity Stratix® III L FPGA option for designs needing tens of thousands of logic elements, on-chip embedded memory nearing 2.7 Mbits, and a broad I/O complement in a compact BGA package. Its electrical and thermal specifications support integration into commercial electronic systems that prioritize high logic density and significant on-chip storage.

This device is well suited to engineers and design teams building complex digital systems that benefit from a single-chip programmable implementation—providing scalability in logic and memory resources while remaining compliant with RoHS and standard commercial temperature requirements.

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