EP3SL50F780I4N

The EP3SL50F780I4N is a Stratix® III L Field Programmable Gate Array (FPGA) from Intel, offered in a 780-BBGA FCBGA package. This device provides a high-density programmable logic resource with a large number of I/Os and on-chip memory for complex digital designs.

Targeted at designs that require substantial logic capacity, embedded RAM, and broad interfacing, the device combines approximately 47,500 logic elements, roughly 2.18 Mbits of embedded memory, and 488 I/Os in a surface-mount industrial-grade package with an extended operating temperature range.

Key Features

• Core (Logic) Approximately 47,500 logic elements organized across 1,900 logic blocks to implement complex combinational and sequential logic.
• Embedded Memory Approximately 2.18 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without immediate reliance on external memory.
• I/O Capacity 488 I/O pins to support high-pin-count interfacing and multiple parallel or serial connections.
• Power Core supply voltage range of 0.86 V to 1.15 V to match targeted power-domain designs.
• Package & Mounting 780-BBGA FCBGA package (supplier device package: 780-FBGA, 29×29) in a surface-mount form factor for compact, high-density board layouts.
• Operating Range & Grade Industrial grade device with an operating temperature range of −40 °C to 100 °C for extended-environment deployments.
• Compliance RoHS compliant, meeting standard environmental material requirements.

Typical Applications

• High-density digital systems Implement complex logic functions and control algorithms using the large logic-element count and on-chip memory.
• Interface aggregation Aggregate and bridge multiple peripheral interfaces or parallel buses using the device’s 488 I/Os.
• Industrial control equipment Deploy in automation and control applications that benefit from industrial temperature range and surface-mount BBGA packaging.

Unique Advantages

• High logic density: Approximately 47,500 logic elements enable dense implementations of complex designs without immediate partitioning across multiple devices.
• Significant on-chip RAM: Roughly 2.18 Mbits of embedded memory reduces dependence on external memory for many buffering and temporary-storage needs.
• Extensive I/O: 488 available I/Os simplify direct interfacing to numerous peripherals, sensors, and buses, lowering external interface complexity.
• Industrial temperature rating: −40 °C to 100 °C supports deployment in extended-temperature environments.
• Compact, high-pin-count package: 780-BBGA (780-FBGA, 29×29) provides high I/O density in a surface-mount footprint suitable for space-constrained PCBs.
• Flexible power domain design: Core voltage range of 0.86 V–1.15 V allows integration into a variety of power architectures.

Why Choose EP3SL50F780I4N?

The EP3SL50F780I4N balances high logic capacity, on-chip memory, and extensive I/O in a single Stratix® III L FPGA package from Intel, making it well-suited for engineers building dense digital systems and industrial applications. Its combination of approximately 47,500 logic elements, roughly 2.18 Mbits of embedded RAM, and 488 I/Os provides integration that can reduce external component count and simplify board-level design.

Backed by Intel as the manufacturer and offered in an industrial-grade, surface-mount 780-BBGA package, this device is appropriate for projects that require scalable logic resources, significant local memory, and a broad interface set within an extended operating temperature range.

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