EP3SL50F780I4LG

The EP3SL50F780I4LG is a Stratix® III L field‑programmable gate array (FPGA) in a 780‑BBGA FCBGA package, delivering a balance of logic, memory, and I/O for demanding embedded and high‑performance designs. As a member of the Stratix III family, the device is built on a 65‑nm process and targets applications that require high logic density, substantial on‑chip RAM, and flexible I/O in an industrial‑grade component.

Key electrical and environmental characteristics include a selectable core voltage range from 860 mV to 1.15 V and an operating temperature range of −40 °C to 100 °C, making the device suitable for industrial temperature environments and surface‑mount assembly in a 29×29 780‑FBGA footprint.

Key Features

• Core resources — 47,500 logic elements provide substantial programmable logic capacity for control, signal processing, and glue‑logic functions.
• Embedded memory — Approximately 2.18 Mbits of on‑chip RAM for FIFOs, buffering, and local data storage within the FPGA fabric.
• I/O and package — 488 user I/O pins in a modular I/O bank architecture, supplied in a 780‑BBGA (29×29) FCBGA surface‑mount package.
• Power and core voltage — Selectable core voltage operation with an allowable supply range of 860 mV to 1.15 V, and family Programmable Power Technology to manage power/performance tradeoffs.
• Clocking and PLLs — Family capabilities include up to 16 global clocks, regional and peripheral clock resources, and up to 12 PLLs for clock synthesis and dynamic phase control.
• DSP and high‑speed I/O — Stratix III family DSP blocks support a range of multiplier sizes (9×9, 12×12, 18×18, 36×36) and high‑speed differential I/O with SERDES and dynamic phase alignment for up to 1.6 Gbps operation.
• Security and reliability — Family features include optional 256‑bit AES configuration encryption and on‑chip CRC/ECC circuitry for configuration and memory error detection and correction.
• Industrial temperature rating — Rated for −40 °C to 100 °C operation for industrial temperature deployments.

Typical Applications

• High‑performance signal processing — Implement DSP algorithms and custom accelerators using abundant logic elements and dedicated multiplier/DSP blocks.
• Networking and communications — Support for high‑speed differential I/O and SERDES makes the device suitable for communication interfaces and protocol processing.
• Memory interface controllers — On‑chip memory and dedicated I/O features enable implementation of interfaces for DDR/DDR2/DDR3 and other high‑speed memories (family‑level support).
• Embedded systems and IP integration — Integrate soft processors, megafunction IP, and custom peripherals using the device’s logic, memory, and clocking resources.

Unique Advantages

• Substantial programmable capacity: 47,500 logic elements reduce the need for external glue logic and enable complex designs within a single device.
• Integrated memory and DSP: Approximately 2.18 Mbits of embedded RAM plus family DSP blocks facilitate low‑latency data processing and efficient algorithm implementation.
• Flexible power/performance tradeoffs: Selectable core voltage and Programmable Power Technology allow designers to tune operation between higher performance and lower power usage.
• Robust I/O and packaging: 488 user I/O in a 780‑BBGA surface‑mount package provides a compact, high‑pin‑count solution for dense system designs.
• Industrial temperature capability: Rated for −40 °C to 100 °C to meet industrial environmental requirements.
• Security and reliability features: Family support for AES configuration encryption, CRC, and ECC improves design protection and operational integrity.

Why Choose EP3SL50F780I4LG?

The EP3SL50F780I4LG combines a high logic count, meaningful on‑chip memory, and extensive I/O in a compact 780‑BBGA package, targeting designers who need a balance of performance, integration, and industrial temperature operation. Family features such as selectable core voltage, programmable power control, rich clocking resources, and built‑in security and error‑detection support make it suitable for demanding embedded, DSP, and communications applications.

With support for common FPGA megafunctions and embedded processor integration at the family level, the device is positioned for designs that require scalability, IP reuse, and long‑term availability within the Stratix III ecosystem.

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