EP3SL50F780I4LN

The EP3SL50F780I4LN is a Stratix® III L Field Programmable Gate Array (FPGA) IC offering high-density programmable logic in a 780‑ball BGA package. It combines a large logic fabric, significant on‑chip memory, and a high I/O count for industrial-grade programmable designs.

Designed for industrial applications, the device supports a broad supply voltage window and an extended operating temperature range, making it suitable for systems that require configurable logic, substantial embedded memory, and many external interfaces.

Key Features

• Logic Capacity — Provides 47,500 logic elements to implement complex digital functions and custom hardware logic blocks.
• Embedded Memory — Approximately 2.18 Mbits of on‑chip RAM for data buffering, LUT storage, and embedded state machines.
• I/O Density — 488 user I/O pins to support numerous peripherals, buses, and high‑pin‑count systems.
• Power and Core Voltage — Operates from a core supply range of 860 mV to 1.15 V, enabling compatibility with a variety of system power architectures.
• Package and Mounting — 780‑BBGA (FCBGA) package, supplier device package listed as 780‑FBGA (29×29), designed for surface‑mount PCB assembly.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
• Regulatory Compliance — RoHS compliant for lead‑free manufacturing processes.

Typical Applications

• Industrial Control & Automation — Deploy as the configurable logic core for control systems, PLC extensions, and machine automation requiring robust temperature performance.
• Embedded Processing & Custom Acceleration — Implement custom datapaths, protocol offloads, and hardware accelerators using the device’s large logic and memory resources.
• High‑I/O Interface Systems — Support complex sensor arrays, multi‑bus connections, or large peripheral sets with 488 I/O pins.

Unique Advantages

• High Logic Density: 47,500 logic elements enable consolidation of multiple functions into a single programmable device, reducing BOM count.
• Substantial Embedded Memory: Approximately 2.18 Mbits of on‑chip RAM supports buffering and state storage without external memory for many designs.
• Large I/O Count: 488 I/Os provide flexibility to interface with multiple subsystems and high‑pin‑count peripherals directly.
• Industrial Reliability: Specified for −40 °C to 100 °C operation and provided in a robust BGA package for long‑term deployment in industrial environments.
• Flexible Power Envelope: Core voltage support from 860 mV to 1.15 V accommodates a range of system power schemes and modern power‑management approaches.
• RoHS Compliant: Meets lead‑free manufacturing requirements for modern electronics production.

Why Choose EP3SL50F780I4LN?

The EP3SL50F780I4LN positions itself as a high‑density, industrial‑grade FPGA option where substantial programmable logic, embedded memory, and a high number of I/Os are required. Its combination of 47,500 logic elements, approximately 2.18 Mbits of on‑chip RAM, and 488 I/Os makes it well suited for consolidating discrete functions and custom hardware acceleration into a single device.

With a wide operating temperature range, surface‑mount 780‑BBGA packaging, and RoHS compliance, this FPGA provides a practical, durable foundation for industrial applications that demand configurable logic, scalable integration, and predictable thermal performance.

Request a quote or contact sales to discuss availability, pricing, and how EP3SL50F780I4LN can fit your next industrial FPGA design.