EP3SL70F484C3

The EP3SL70F484C3 is a Stratix® III L Field Programmable Gate Array (FPGA) from Intel, provided in a 484-ball ball-grid array (FCBGA) package. It combines high logic capacity, significant on-chip RAM, and a substantial I/O count in a surface-mount package targeted for commercial-grade digital systems.

With 67,500 logic elements and approximately 2.7 Mbits of embedded memory, this device is suited for high-density logic integration and memory-intensive functions where a large number of user I/Os and compact packaging are required.

Key Features

• Logic Capacity — 67,500 logic elements to implement complex digital functions and high-density logic designs.
• Embedded Memory — Approximately 2.7 Mbits of on-chip RAM to support buffering, lookup tables, and state storage for data‑intensive tasks.
• I/O — 296 user I/Os to support extensive external interfacing and multi-channel connectivity.
• Power Supply — Core voltage range from 860 mV to 1.15 V to match system power architectures and enable predictable power budgeting.
• Package and Mounting — 484-BBGA (FCBGA) package in a 23 × 23 format and surface-mount construction for compact board-level integration.
• Commercial Grade — Rated for 0 °C to 85 °C operating temperature for typical commercial environments.
• Regulatory — RoHS-compliant construction to meet lead-free manufacturing requirements.

Typical Applications

• Complex digital systems — Use the large logic capacity and embedded memory to implement multi-function digital controllers and custom accelerators.
• High-channel I/O designs — Leverage 296 I/Os for multi-lane interfaces, sensor aggregation, or FPGA-based I/O expansion.
• Memory-intensive processing — Employ approximately 2.7 Mbits of on-chip RAM for buffering, packet handling, or lookup-based processing tasks.

Unique Advantages

• High integration density — 67,500 logic elements enable consolidated implementation of complex logic that can reduce external component count.
• Substantial embedded memory — Approximately 2.7 Mbits of on-chip RAM supports data buffering and state storage without immediate dependence on external memory.
• Extensive I/O — 296 user I/Os provide flexibility for interfacing multiple peripherals and high-pin-count systems.
• Compact board footprint — 484-BBGA (23 × 23) surface-mount package delivers high pin density in a space-efficient form factor.
• Commercial temperature rating — Specified 0 °C to 85 °C operation aligns with a wide range of commercial electronic products.
• RoHS compliant — Allows deployment in lead-free manufacturing flows.

Why Choose EP3SL70F484C3?

The EP3SL70F484C3 positions itself as a high-capacity, memory-rich FPGA option for designers needing substantial logic resources, significant embedded RAM, and a large number of I/Os within a compact FCBGA package. Its commercial-grade temperature range and RoHS compliance make it appropriate for mainstream electronic products that require reliable digital integration.

This device is a practical choice for engineering teams building high-density, memory-dependent designs who need clear, verifiable device characteristics—67,500 logic elements, approximately 2.7 Mbits of on-chip RAM, 296 I/Os, and a defined power and temperature envelope—to inform BOM decisions and system architecture.

Request a quote or submit your RFQ to receive pricing and availability for the EP3SL70F484C3.