EP3SL70F780C2G
| Part Description |
Stratix® III L Field Programmable Gate Array (FPGA) IC 488 2699264 67500 780-BBGA, FCBGA |
|---|---|
| Quantity | 686 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 488 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2700 | Number of Logic Elements/Cells | 67500 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 2699264 |
Overview of EP3SL70F780C2G – Stratix® III L FPGA, 67,500 Logic Elements, 780-FBGA
The EP3SL70F780C2G is a Stratix® III L field-programmable gate array (FPGA) in a 780-FBGA (29×29) package from Intel. This commercial-grade device combines a large logic capacity with multi-megabit embedded memory and flexible I/O for high-performance logic, DSP and embedded system designs.
Designed for applications that require high integration and configurable performance, the device delivers 67,500 logic elements, approximately 2.7 Mbits of on-chip RAM, and 488 user I/O pins in a surface-mount FCBGA package while supporting selectable core voltage and power management features from the Stratix III family.
Key Features
- Core Logic 67,500 logic elements for implementing complex control, processing and glue-logic functions.
- Embedded Memory Approximately 2.7 Mbits of on-chip RAM (2,699,264 bits) for FIFOs, buffers and on-chip data storage.
- I/O Capacity 488 user I/O pins with modular I/O bank architecture suitable for memory interfaces and diverse signaling standards.
- Package & Mounting 780-FBGA (29×29) FCBGA surface-mount package designed for high-density board integration.
- Power Supply Selectable core voltage operation with a supply range of 860 mV to 1.15 V to balance performance and power.
- Operating Range Commercial operating temperature range from 0 °C to 85 °C.
- Family-Level Capabilities Stratix III family features include high-speed DSP blocks, multiple PLLs and clock resources, SERDES support, built-in CRC and ECC for configuration and memory reliability, 256-bit AES configuration security options, and support for Nios® II embedded processor and megafunction IP (as documented in the Stratix III device handbook).
- Compliance RoHS-compliant for global electronics manufacturing requirements.
Typical Applications
- High-performance networking Use the device’s large logic capacity and family high-speed I/O features to implement packet processing, switch fabric, and protocol bridging functions.
- Digital signal processing Leverage on-chip memory and Stratix III DSP capabilities for FIR filters, accumulation and fixed-point signal processing pipelines.
- Memory interfaces and controllers Implement DDR/DDR2/DDR3 and other external memory interfaces using abundant I/O and modular bank structure.
- Embedded compute and system control Integrate custom hardware accelerators, soft processors and system glue logic within the FPGA fabric and memory resources.
Unique Advantages
- Large, integrated logic and memory: 67,500 logic elements paired with approximately 2.7 Mbits of embedded RAM reduce external memory dependence and simplify board design.
- Flexible I/O in a dense package: 488 user I/Os in a 780-FBGA package enable high pin-count designs while maintaining compact PCB real estate.
- Power configurability: Selectable core voltage (860 mV–1.15 V) helps designers tune power vs. performance for application needs.
- Reliability features: Family-level CRC and ECC support enhance configuration and on-chip memory integrity for higher availability systems.
- Security options: Support for 256-bit AES configuration encryption (Stratix III family capability) helps protect intellectual property and bitstreams.
- Software and IP ecosystem: Compatibility with Stratix III family tools and megafunctions supports rapid integration of common peripherals and processing blocks.
Why Choose EP3SL70F780C2G?
The EP3SL70F780C2G positions itself as a high-capacity, commercially graded FPGA that combines substantial logic resources, multi-megabit embedded memory and extensive I/O in a single surface-mount FCBGA package. It is suited to designers building high-performance logic, DSP accelerators, and complex memory-interface systems who need a configurable, integrated solution with family-level reliability and security features.
Choosing this Stratix III L device enables scalable designs that benefit from the broader Stratix III architecture—selectable power modes, rich clocking and DSP support, and an ecosystem of IP and tooling—helping reduce development time and BOM complexity for demanding applications.
Request a quote or submit a pricing inquiry to receive availability and lead-time information for the EP3SL70F780C2G.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018