EP3SL70F780C2G

IC FPGA 488 I/O 780FBGA
Part Description

Stratix® III L Field Programmable Gate Array (FPGA) IC 488 2699264 67500 780-BBGA, FCBGA

Quantity 686 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O488Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2700Number of Logic Elements/Cells67500
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits2699264

Overview of EP3SL70F780C2G – Stratix® III L FPGA, 67,500 Logic Elements, 780-FBGA

The EP3SL70F780C2G is a Stratix® III L field-programmable gate array (FPGA) in a 780-FBGA (29×29) package from Intel. This commercial-grade device combines a large logic capacity with multi-megabit embedded memory and flexible I/O for high-performance logic, DSP and embedded system designs.

Designed for applications that require high integration and configurable performance, the device delivers 67,500 logic elements, approximately 2.7 Mbits of on-chip RAM, and 488 user I/O pins in a surface-mount FCBGA package while supporting selectable core voltage and power management features from the Stratix III family.

Key Features

  • Core Logic  67,500 logic elements for implementing complex control, processing and glue-logic functions.
  • Embedded Memory  Approximately 2.7 Mbits of on-chip RAM (2,699,264 bits) for FIFOs, buffers and on-chip data storage.
  • I/O Capacity  488 user I/O pins with modular I/O bank architecture suitable for memory interfaces and diverse signaling standards.
  • Package & Mounting  780-FBGA (29×29) FCBGA surface-mount package designed for high-density board integration.
  • Power Supply  Selectable core voltage operation with a supply range of 860 mV to 1.15 V to balance performance and power.
  • Operating Range  Commercial operating temperature range from 0 °C to 85 °C.
  • Family-Level Capabilities  Stratix III family features include high-speed DSP blocks, multiple PLLs and clock resources, SERDES support, built-in CRC and ECC for configuration and memory reliability, 256-bit AES configuration security options, and support for Nios® II embedded processor and megafunction IP (as documented in the Stratix III device handbook).
  • Compliance  RoHS-compliant for global electronics manufacturing requirements.

Typical Applications

  • High-performance networking  Use the device’s large logic capacity and family high-speed I/O features to implement packet processing, switch fabric, and protocol bridging functions.
  • Digital signal processing  Leverage on-chip memory and Stratix III DSP capabilities for FIR filters, accumulation and fixed-point signal processing pipelines.
  • Memory interfaces and controllers  Implement DDR/DDR2/DDR3 and other external memory interfaces using abundant I/O and modular bank structure.
  • Embedded compute and system control  Integrate custom hardware accelerators, soft processors and system glue logic within the FPGA fabric and memory resources.

Unique Advantages

  • Large, integrated logic and memory: 67,500 logic elements paired with approximately 2.7 Mbits of embedded RAM reduce external memory dependence and simplify board design.
  • Flexible I/O in a dense package: 488 user I/Os in a 780-FBGA package enable high pin-count designs while maintaining compact PCB real estate.
  • Power configurability: Selectable core voltage (860 mV–1.15 V) helps designers tune power vs. performance for application needs.
  • Reliability features: Family-level CRC and ECC support enhance configuration and on-chip memory integrity for higher availability systems.
  • Security options: Support for 256-bit AES configuration encryption (Stratix III family capability) helps protect intellectual property and bitstreams.
  • Software and IP ecosystem: Compatibility with Stratix III family tools and megafunctions supports rapid integration of common peripherals and processing blocks.

Why Choose EP3SL70F780C2G?

The EP3SL70F780C2G positions itself as a high-capacity, commercially graded FPGA that combines substantial logic resources, multi-megabit embedded memory and extensive I/O in a single surface-mount FCBGA package. It is suited to designers building high-performance logic, DSP accelerators, and complex memory-interface systems who need a configurable, integrated solution with family-level reliability and security features.

Choosing this Stratix III L device enables scalable designs that benefit from the broader Stratix III architecture—selectable power modes, rich clocking and DSP support, and an ecosystem of IP and tooling—helping reduce development time and BOM complexity for demanding applications.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the EP3SL70F780C2G.

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