EP3SL70F780C2

The EP3SL70F780C2 is an Intel Stratix® III L field programmable gate array (FPGA) supplied in a 780-FBGA (29×29) surface-mount package. It delivers a high-density programmable fabric with 67,500 logic elements, approximately 2.7 Mbits of embedded memory, and 488 user I/O pins for complex logic and multi-interface designs.

Designed for commercial-grade applications, this device operates from a core supply range of 860 mV to 1.15 V and is specified for operation from 0 °C to 85 °C. The device is RoHS compliant and available in a 780-BBGA/FCBGA package for board-level integration.

Key Features

• High-density logic — 67,500 logic elements to support large-scale custom logic implementations and complex state machines.
• Embedded memory — Approximately 2.7 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage without external memory.
• Rich I/O count — 488 user I/O pins enabling multiple external interfaces and high-pin-count system connectivity.
• Power and voltage — Core supply range of 0.86 V to 1.15 V provides defined power requirements for system power design.
• Package and mounting — 780-BBGA / FCBGA package (supplier device package: 780-FBGA 29×29) in a surface-mount form factor for compact PCB footprints.
• Commercial temperature grade — Rated for 0 °C to 85 °C suitable for commercial and consumer system environments.
• Environmental compliance — RoHS compliant to support regulatory and end-product requirements.

Typical Applications

• Complex digital processing — Implement high-logic-count custom processing blocks and datapath acceleration where on-chip memory and abundant logic are required.
• Multi-interface bridging — Leverage 488 I/Os to interface between multiple peripherals, sensors, and external devices in embedded systems.
• Prototyping and evaluation — Use the device for validating large-scale logic designs and system prototypes in a commercial temperature environment.

Unique Advantages

• High integration density: 67,500 logic elements and on-chip memory reduce the need for external components and simplify board-level design.
• Extensive I/O capability: 488 user I/Os enable flexible connectivity for multi-channel and multi-protocol designs.
• Compact package: 780-FBGA (29×29) surface-mount package supports high-density PCB layouts and scalable form factors.
• Defined commercial operating range: Specified 0 °C to 85 °C operation for reliable performance in commercial and consumer products.
• Regulatory compliance: RoHS compliance simplifies environmental qualification and product acceptance for many markets.

Why Choose EP3SL70F780C2?

The EP3SL70F780C2 positions itself as a high-density, commercially rated Stratix® III L FPGA option for engineers seeking substantial logic capacity, on-chip memory, and a large I/O complement in a compact 780-FBGA package. Its combination of 67,500 logic elements, approximately 2.7 Mbits of embedded RAM, and 488 I/Os makes it suitable for demanding digital designs and interface-heavy applications.

For design teams focused on commercial and consumer products that require a high level of integration and clear electrical and environmental specifications, EP3SL70F780C2 offers a verifiable platform to implement and scale complex FPGA-based functionality.

Request a quote or submit your requirements to receive pricing and availability for EP3SL70F780C2. Our team will respond with a tailored proposal to support your design timeline and procurement needs.