EP3SL70F780I4

The EP3SL70F780I4 is a Stratix® III L Field Programmable Gate Array (FPGA) from Intel supplied in a 780‑ball FCBGA package. It integrates a large programmable fabric with on‑chip memory and dense I/O to support complex, reconfigurable logic designs in industrial environments.

With 67,500 logic elements, approximately 2.7 Mbits of embedded memory, and 488 I/O pins, this device targets designs that require significant logic capacity, substantial embedded RAM, and a high count of external interfaces while operating across an industrial temperature range.

Key Features

• Logic Capacity 67,500 logic elements provide ample programmable resources for complex digital designs; the device also lists 2,700 logic array blocks for cluster-level organization.
• Embedded Memory Approximately 2.7 Mbits of on‑chip RAM (2,699,264 bits) for data buffering, FIFOs, and local storage to support system-level memory requirements without external RAM.
• I/O Density 488 I/O pins enable connectivity to multiple peripherals, buses, and external devices for system integration and interface flexibility.
• Power Supply Range Core voltage support from 0.860 V to 1.15 V to match system power domains and board-level power design constraints.
• Package and Mounting 780‑BBGA (FCBGA) package, supplier designation 780‑FBGA (29×29), in a surface‑mount form factor suitable for modern PCB assembly.
• Industrial Temperature Range Rated for operation from −40°C to 100°C to meet the thermal requirements of industrial and ruggedized deployments.
• Environmental Compliance RoHS compliant, supporting regulatory and manufacturing requirements for lead‑free assemblies.

Typical Applications

• Industrial Control and Automation Use the device to implement programmable control logic, protocol bridging, and real‑time signal processing within industrial systems.
• Communications Infrastructure Implement packet processing, protocol handling, and interface bridging where dense logic and embedded memory are required.
• High‑Density Embedded Systems Integrate complex custom logic and local buffering in space‑constrained boards using the 780‑ball FCBGA package and surface‑mount mounting.

Unique Advantages

• Substantial Logic Resources: 67,500 logic elements enable implementation of large, custom digital architectures without immediate partitioning to multiple devices.
• Significant On‑Chip Memory: Approximately 2.7 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary data storage.
• High I/O Count: 488 I/Os provide flexibility to connect numerous peripherals, interfaces, and sensors directly to the FPGA fabric.
• Industrial‑Grade Operation: Specified operation from −40°C to 100°C supports deployment in industrial and temperature‑challenging environments.
• Compact, Surface‑Mount Package: The 780‑BBGA (29×29) FCBGA package offers a high‑density footprint for board‑level integration while supporting modern assembly processes.
• Regulatory Compatibility: RoHS compliance facilitates integration into lead‑free manufacturing flows and global product supply chains.

Why Choose EP3SL70F780I4?

The EP3SL70F780I4 combines a large programmable fabric, substantial embedded memory, and a high pin count in a compact FCBGA package designed for industrial operation. These attributes make it well suited for projects that demand on‑device logic capacity, embedded RAM, and extensive I/O while maintaining a board‑level footprint amenable to modern assembly.

This device is appropriate for engineering teams designing industrial control systems, communications equipment, or other embedded platforms that require reprogrammability, strong on‑chip resources, and compliance with RoHS manufacturing requirements.

Request a quote or submit an inquiry to receive pricing and availability details for the EP3SL70F780I4. Our team can provide procurement options and lead‑time information to support your design timeline.