EP3SL70F780I4LN

The EP3SL70F780I4LN is a Stratix® III L FPGA IC delivering a high-density, industrial-grade programmable logic platform. It combines 67,500 logic elements with approximately 2.7 Mbits of embedded memory and 488 I/O pins in a 780-ball FCBGA package for compact, surface-mount board designs.

Designed for engineers implementing complex digital logic in industrial environments, this device provides a balance of integration density, configurable I/O, and a wide operating temperature range to support robust system designs.

Key Features

• Logic Capacity  67,500 logic elements provide substantial on-chip programmable logic resources for complex combinational and sequential designs.
• Embedded Memory  Approximately 2.7 Mbits of on-chip RAM to support buffering, lookup tables, and state storage without external memory.
• I/O Density  488 user I/O pins enable high-connectivity designs for multi-channel interfaces and parallel data paths.
• Power  Core voltage supply range from 860 mV to 1.15 V to match system power-rail requirements and ASIC-grade core power domains.
• Package and Mounting  780-ball FCBGA (29×29) package designed for surface-mount assembly to save board area while supporting high pin-count routing.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet demanding ambient conditions in industrial deployments.
• Compliance  RoHS compliant manufacturing supports environmental and regulatory requirements for lead-free assembly.

Typical Applications

• Industrial Control Systems  Deploy programmable logic capacity and industrial temperature tolerance for motor control, PLC functions, and factory automation interfaces.
• High-Density I/O Interfaces  Use the large number of I/Os to implement parallel data capture, protocol bridging, or multi-channel sensor aggregation.
• Embedded Memory-Intensive Logic  Leverage approximately 2.7 Mbits of on-chip RAM for buffering, packet processing, and state machines without immediate external memory needs.

Unique Advantages

• High Logic Integration: 67,500 logic elements reduce reliance on multiple discrete devices and simplify board-level integration.
• On-Chip Memory: Approximately 2.7 Mbits of embedded memory supports local data storage and accelerates real-time processing.
• Large I/O Count: 488 I/O pins enable flexible interfacing to sensors, peripherals, and parallel buses without external expanders.
• Industrial Reliability: Rated for −40 °C to 100 °C operation to maintain functionality across harsh ambient conditions.
• Compact Power and Package: 780-ball FCBGA package and a core voltage range of 860 mV to 1.15 V help optimize board area and power distribution.
• RoHS Compliant: Meets lead-free assembly requirements for modern manufacturing processes.

Why Choose EP3SL70F780I4LN?

The EP3SL70F780I4LN positions itself as a high-density, industrial-grade FPGA option for engineers who need substantial programmable logic, embedded memory, and extensive I/O in a compact surface-mount package. Its combination of 67,500 logic elements, approximately 2.7 Mbits of on-chip RAM, and 488 I/Os makes it well-suited to complex digital designs that require both integration and rugged operating temperature capability.

This device is appropriate for development and production systems requiring scalable programmable resources and robust temperature performance, delivering a balance of integration density and board-area efficiency for industrial applications.

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