EP3SL50F780C4LN

The EP3SL50F780C4LN is a Stratix® III L field programmable gate array (FPGA) in a 780-BBGA (FCBGA) package designed for commercial electronic designs. It provides a high logic-element count, substantial on-chip RAM, and a large number of I/O pins for dense digital integration.

This device is suited for designs that require approximately 47,500 logic elements, about 2.18 Mbits of embedded memory, and up to 488 I/O signals while operating within a commercial temperature range and standard surface-mount packaging.

Key Features

• Core Logic — Approximately 47,500 logic elements for complex combinational and sequential logic integration.
• Embedded Memory — Approximately 2.18 Mbits of on-chip RAM to support buffering, lookup tables, and local storage.
• I/O Density — 488 general-purpose I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Package and Mounting — 780-BBGA (FCBGA) 29×29 package in a surface-mount form factor for compact board-level integration.
• Power — Core supply range from 0.86 V to 1.15 V, enabling compatibility with systems using low-voltage core rails.
• Operating Range and Grade — Commercial grade device rated for 0 °C to 85 °C operation.
• Compliance — RoHS compliant.

Typical Applications

• High-density digital processing — Implements complex logic functions and custom processing pipelines using the device's large logic element count and embedded memory.
• Interface bridging and protocol adaptation — Supports wide I/O counts for interfacing between multiple parallel or serial subsystems.
• On-chip buffering and data staging — Uses approximately 2.18 Mbits of embedded RAM for temporary storage, FIFOs, and data management.
• Commercial product development — Suitable for commercial-temperature-range designs requiring a compact FCBGA package and surface-mount assembly.

Unique Advantages

• High logic capacity: 47,500 logic elements enable implementation of sizeable custom logic and multiple concurrent functions on a single device.
• Substantial embedded memory: Approximately 2.18 Mbits of on-chip RAM reduces external memory dependence and simplifies board-level BOM.
• Extensive I/O count: 488 I/O pins provide flexibility for wide data buses, parallel peripherals, and dense connector interfaces.
• Compact FCBGA packaging: 780-ball FCBGA (29×29) delivers high pin count in a compact, surface-mount form factor for space-constrained layouts.
• Low-voltage core support: 0.86 V to 1.15 V supply range aligns with low-voltage core domains used in modern system architectures.
• RoHS compliant: Conforms to lead-free manufacturing requirements for environmentally conscious designs.

Why Choose EP3SL50F780C4LN?

The EP3SL50F780C4LN combines a high logic element count, significant on-chip RAM, and a large I/O complement within a compact 780-BBGA surface-mount package, making it well suited for commercial designs that require dense digital integration and local memory resources. Its specified core voltage range and commercial operating temperature make it appropriate for mainstream electronic products and development platforms.

For designers seeking a Stratix® III L family FPGA with measurable logic capacity, embedded memory, and I/O flexibility, this device offers a balance of integration and board-level compactness backed by the device specifications provided.

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