EP3SL50F780C4

The EP3SL50F780C4 is a Stratix® III L Field Programmable Gate Array (FPGA) supplied in a 780-BBGA FCBGA package. It provides a high-density programmable-logic resource with a large I/O count and embedded memory for implementing custom digital designs.

Targeted at commercial electronic systems, this surface-mount FPGA delivers a combination of logic capacity, on-chip RAM, and extensive I/O connectivity while operating within a 0 °C to 85 °C commercial temperature range.

Key Features

• Core Logic  47,500 logic elements for implementing complex digital functions and custom processing blocks.
• Embedded Memory  Approximately 2.18 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage.
• I/O Density  488 I/O pins to support high-pin-count interface requirements and parallel connectivity.
• Power Supply  Core voltage supply range of 860 mV to 1.15 V to match system power rails and design constraints.
• Package & Mounting  780-BBGA (FCBGA) package; supplier device package listed as 780-FBGA (29×29) and designed for surface-mount assembly.
• Operating Range & Grade  Commercial-grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance  RoHS-compliant construction for regulatory and manufacturing consistency.

Typical Applications

• High-density digital systems  Implement custom logic, signal processing blocks, and control functions using the device’s 47,500 logic elements and embedded RAM.
• I/O-intensive interfaces  Support multiple parallel interfaces and external peripherals with 488 available I/O pins.
• Compact board-level integration  The 780-BBGA FCBGA surface-mount package enables dense PCB designs where board space and routing are priorities.

Unique Advantages

• High logic capacity: 47,500 logic elements allow integration of sizable custom logic blocks and complex state machines on a single device.
• Built-in memory resources: Approximately 2.18 Mbits of on-chip RAM reduce dependency on external memory for many buffering and storage needs.
• Extensive I/O: 488 I/Os simplify connection to multiple peripherals, sensors, or parallel interfaces without intermediate multiplexing.
• Surface-mount FCBGA package: The 780-BBGA package supports compact, high-density PCB implementations and modern assembly processes.
• Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C operation and RoHS-compliant for broad commercial use and regulatory alignment.

Why Choose EP3SL50F780C4?

The EP3SL50F780C4 positions itself as a high-capacity, I/O-rich Stratix® III L FPGA suitable for commercial electronic designs that require substantial programmable logic and on-chip memory. Its combination of 47,500 logic elements, approximately 2.18 Mbits of embedded RAM, and 488 I/Os enables consolidation of complex digital functions onto a single device.

Designed for surface-mount integration in a 780-BBGA FCBGA package and rated for commercial temperature operation, this device offers a balance of integration and board-level density for designers focused on scalable, reliable system implementations.

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