EP3SL50F780C3

The EP3SL50F780C3 is an Intel Stratix® III L Field Programmable Gate Array (FPGA) in a 780-ball FCBGA package designed for commercial electronic products. It delivers substantial programmable logic capacity, embedded memory, and a high pin count in a compact surface-mount footprint.

With 47,500 logic elements, approximately 2.18 Mbits of on-chip RAM and 488 user I/O, this device targets applications that require dense digital integration, flexible I/O routing and low-voltage core operation.

Key Features

• Core Capacity  47,500 logic elements provide extensive resources for implementing complex digital functions and custom logic pipelines.
• Embedded Memory  Approximately 2.18 Mbits of on-chip RAM for data buffering, state storage and intermediate processing.
• I/O  488 user I/O pins support high-channel count designs and flexible interfacing with external peripherals and subsystems.
• Package & Mounting  780-FBGA (29×29) FCBGA package in a surface-mount form factor enables high-density PCB integration.
• Power Supply  Core supply range of 0.86 V to 1.15 V to match system power architecture and low-voltage FPGA designs.
• Operating Range & Grade  Commercial grade device specified for 0 °C to 85 °C operation.
• Regulatory  RoHS compliant for use in lead-free, environmentally conscious assemblies.

Typical Applications

• Commercial Embedded Systems  Implements custom control logic, protocol handling and data conditioning in space-constrained, surface-mount designs.
• Communications Equipment  Provides programmable logic capacity and high I/O count for packet processing, protocol bridging and interface aggregation.
• Test and Measurement  Hosts data capture, signal processing and timing logic where on-chip RAM and dense logic are required.
• Prototyping and Development Platforms  Serves as a high-capacity target device for validating complex digital architectures and system integration tasks.

Unique Advantages

• High logic density: 47,500 logic elements enable implementation of sizable digital designs without immediate need for external logic expansion.
• Meaningful embedded memory: Approximately 2.18 Mbits of on-chip RAM reduces dependency on external memory for many buffering and stateful tasks.
• Extensive I/O: 488 user I/Os support wide parallel interfaces and a mix of control, data and signaling connections.
• Compact surface-mount FCBGA: The 780-FBGA (29×29) package delivers a high-pin-count solution in a small PCB footprint for dense board-level integration.
• Low-voltage core operation: Core supply range from 0.86 V to 1.15 V aligns with modern low-voltage power domains.
• RoHS compliant: Meets lead-free manufacturing requirements for commercial product assemblies.

Why Choose EP3SL50F780C3?

The EP3SL50F780C3 combines substantial programmable logic resources, embedded memory and a high I/O count in a compact 780-FBGA surface-mount package, making it well suited for commercial designs that require dense logic integration and flexible interfacing. Its specified core voltage range and commercial operating temperature window allow straightforward integration into standard low-voltage, commercial product environments.

This device is a fit for engineering teams building complex digital systems, communication modules and development platforms that need on-chip memory and high pin-count connectivity in a space-efficient package. RoHS compliance supports lead-free production and commercial deployment.

Request a quote or submit a purchase inquiry to learn about availability and pricing for the EP3SL50F780C3.