EP3SL50F484I4N

The EP3SL50F484I4N is a Stratix® III L Field Programmable Gate Array (FPGA) IC designed for industrial applications requiring high-density programmable logic, embedded memory, and flexible I/O. This surface-mount FCBGA device integrates a large logic fabric and on-chip RAM to enable custom digital implementations and system-level consolidation.

With 47,500 logic elements, approximately 2.18 Mbits of embedded memory, and 296 I/O pins in a 484-BBGA (23 × 23) package, the device targets designs that need substantial logic capacity, significant local memory, and robust industrial temperature operation.

Key Features

• Logic Capacity  Provides 47,500 logic elements to implement complex custom logic, control functions, and programmable datapaths.
• Embedded Memory  Approximately 2.18 Mbits (2,184,192 bits) of on-chip RAM for buffering, FIFOs, and local storage to support data-intensive processing.
• I/O Density  296 general-purpose I/O pins enable broad external interfacing for peripherals, sensors, and board-level connectivity.
• Power  Core supply range from 860 mV to 1.15 V to match system power architectures and core voltage requirements.
• Package & Mounting  484-BBGA (FCBGA) package, supplier device package 484-FBGA (23 × 23), designed for surface-mount assembly.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet industrial temperature demands.
• Standards Compliance  RoHS compliant for lead-free manufacturing and regulatory alignment.

Typical Applications

• Industrial Control Systems  Implement custom control logic, I/O aggregation, and protocol bridging in equipment operating across −40 °C to 100 °C.
• Embedded Data Processing  On-chip RAM and abundant logic elements support local buffering and real-time data handling for sensor and signal-processing tasks.
• High-Density I/O Interfaces  Use the device's 296 I/O pins to consolidate multiple peripheral interfaces or to provide extensive board-level connectivity.
• Custom Hardware Prototyping  Provision reconfigurable logic and memory resources for validation and iterative development of hardware-accelerated functions.

Unique Advantages

• Substantial Logic Resource: 47,500 logic elements enable implementation of large-scale custom logic and complex state machines without immediate upscaling.
• On-Chip Memory Capacity: Approximately 2.18 Mbits of embedded RAM reduces dependence on external memory for many buffering and control functions, simplifying board designs.
• High I/O Count: 296 I/O pins provide flexibility to interface with multiple subsystems, sensors, and peripherals directly from the FPGA.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to support applications deployed in challenging environmental conditions.
• Compact FCBGA Packaging: 484-BBGA (23 × 23) packaging optimizes board area while delivering high pin density for system integration.
• RoHS Compliant: Aligns with lead-free manufacturing practices for global production requirements.

Why Choose EP3SL50F484I4N?

The EP3SL50F484I4N combines a large logic element count, substantial embedded memory, and a high I/O count in an industrial-grade, surface-mount FCBGA package. It is positioned for engineers and procurement teams seeking a programmable, high-capacity device capable of consolidating functions and reducing external component count in industrial and embedded systems.

This device suits designs that require scalable programmable logic, local memory for buffering and processing, and robust temperature operation. Its compact 484-BBGA footprint and RoHS compliance help support manufacturability and deployment across a range of industrial applications.

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