EP3SL50F484I4L

The EP3SL50F484I4L is an Intel Stratix® III L Field Programmable Gate Array (FPGA) in a 484‑ball BGA package designed for industrial‑grade applications. It provides a high logic capacity and on‑chip memory combined with a broad I/O count, enabling system designers to implement complex custom logic and interface aggregation within a compact surface‑mount package.

Key device attributes include 47,500 logic elements, approximately 2.18 Mbits of embedded RAM, 296 I/O pins, a supply voltage range of 0.86–1.15 V, and an operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic  47,500 logic elements provide substantial capacity for implementing custom digital functions and mid‑to‑large FPGA designs.
• Embedded Memory  Approximately 2.18 Mbits of on‑chip RAM to support buffering, packet storage, and local data processing without external memory in some designs.
• I/O Resources  296 I/O pins enable extensive external device connectivity and flexible interface routing for system integration.
• Power Supply  Supported core voltage range from 0.860 V to 1.150 V for compatibility with target power architectures.
• Package and Mounting  484‑ball BGA (484‑FBGA, 23×23) package in a surface‑mount form factor for compact board layout and high‑density routing.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet environmental needs of industrial deployments.
• RoHS Compliance  Device is RoHS compliant for regulatory and assembly compatibility.

Typical Applications

• Industrial Automation and Control  Use the device’s industrial temperature rating, high logic capacity, and large I/O count for control logic, protocol bridging, and real‑time signal processing in factory and machine control systems.
• Data Acquisition and Processing  Leverage the device’s embedded RAM and abundant I/Os to buffer and preprocess sensor data or aggregates of channelized inputs before passing data to system controllers.
• Communications Interfaces  Implement custom interface logic and parallel/serial aggregation using the 296 I/O pins and substantial logic resources for control-plane or data‑plane functions.

Unique Advantages

• Significant Logic Capacity:  47,500 logic elements allow implementation of complex finite state machines, custom datapaths, and control logic without immediate need for external processors.
• On‑Chip Memory:  Approximately 2.18 Mbits of embedded RAM reduce dependence on external memory for buffering and local data storage, simplifying board design.
• High I/O Count:  296 I/O pins enable integration of multiple peripherals, sensors, and interfaces while minimizing external glue logic.
• Industrial Reliability:  Rated for −40 °C to 100 °C operation, supporting deployment in demanding temperature environments common in industrial systems.
• Compact Package:  484‑FBGA (23×23) surface‑mount package supports dense PCB integration and effective routing for complex systems.
• Regulatory Compatibility:  RoHS compliance supports modern manufacturing and assembly requirements.

Why Choose EP3SL50F484I4L?

The EP3SL50F484I4L balances high logic capacity, substantial embedded RAM, and a large I/O complement in a compact industrial‑grade BGA package. These characteristics make it well suited for engineers building robust, space‑constrained systems that require custom digital logic, local data buffering, and broad external connectivity.

Delivered by Intel as part of the Stratix® III L family, the device offers designers a combination of integration and environmental robustness that supports long‑term deployments and scalable designs across industrial and demanding embedded applications.

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