EP3SL50F484I3N

The EP3SL50F484I3N is a Stratix® III L Field Programmable Gate Array (FPGA) IC from Intel. It delivers 47,500 logic elements, approximately 2.18 Mbits of embedded memory, and 296 I/O in a 484-ball FCBGA package.

With an industrial-grade temperature range and low-voltage core operation, this FPGA suits designs that require high logic density, significant on-chip memory, and substantial I/O connectivity in a compact surface-mount package.

Key Features

• Core FPGA Stratix® III L family FPGA providing a high-capacity programmable fabric for custom digital logic integration.
• Logic Capacity 47,500 logic elements to implement complex state machines, datapaths, and custom accelerators.
• Embedded Memory Approximately 2.18 Mbits of on-chip RAM to support buffering, FIFOs, and local storage.
• I/O Density 296 I/O pins to support wide parallel interfaces and multiple external peripherals.
• Package & Mounting 484-BBGA (484-FBGA, 23×23) surface-mount package for compact board-level integration.
• Power Core voltage supply range from 860 mV to 1.15 V to match low-voltage system rails.
• Industrial Temperature Rating Rated for operation from −40 °C to 100 °C and specified as Industrial grade for extended environmental coverage.
• Regulatory Compliance RoHS compliant.

Typical Applications

• High-density logic integration — Use the 47,500 logic elements to consolidate complex digital functions and reduce external ASIC/board count.
• I/O-intensive systems — 296 I/O pins enable parallel data paths, wide buses, and multiple peripheral interfaces on a single device.
• Embedded memory-dependent designs — Approximately 2.18 Mbits of on-chip RAM supports buffering, packet handling, and local data storage without external memory.
• Industrial equipment — Industrial-grade temperature range (−40 °C to 100 °C) supports deployment in environments with extended temperature requirements.

Unique Advantages

• High logic density: 47,500 logic elements enable consolidation of complex functions into a single FPGA, simplifying system design.
• Significant on-chip memory: Approximately 2.18 Mbits of embedded RAM reduces dependency on external memory and lowers BOM complexity.
• Extensive I/O: 296 I/O pins accommodate multiple interfaces and parallel data channels for flexible board-level connectivity.
• Compact FCBGA package: 484-ball FBGA (23×23) delivers high pin count in a space-efficient surface-mount footprint.
• Low-voltage core operation: Core supply range of 860 mV to 1.15 V aligns with modern low-voltage system rails to support power-sensitive designs.
• Industrial-grade operation: Rated to operate from −40 °C to 100 °C for reliable performance in extended-temperature environments.

Why Choose EP3SL50F484I3N?

The EP3SL50F484I3N combines substantial logic capacity, on-chip memory, and high I/O density in a compact surface-mount FCBGA package, making it suitable for designs that require consolidated digital functionality with robust environmental performance. Its low-voltage core and RoHS compliance further support modern system requirements.

This device is well suited for engineers and procurement teams seeking a high-density FPGA platform that balances integration, I/O capability, and industrial-temperature operation while keeping board area and external BOM to a minimum.

Request a quote or submit a procurement inquiry to obtain pricing, availability, and ordering information for the EP3SL50F484I3N.