EP3SL50F484I4G

IC FPGA 296 I/O 484FBGA
Part Description

Stratix® III L Field Programmable Gate Array (FPGA) IC 296 2184192 47500 484-BBGA, FCBGA

Quantity 497 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGA, FCBGANumber of I/O296Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1900Number of Logic Elements/Cells47500
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits2184192

Overview of EP3SL50F484I4G – Stratix® III L FPGA, 47,500 Logic Elements, 484-FBGA

The EP3SL50F484I4G is a Stratix® III L Field Programmable Gate Array (FPGA) in a 484-ball FCBGA package designed for high-performance logic, DSP and embedded applications. Built on the Stratix III family architecture, it offers a balance of logic, on-chip memory and high-speed I/O for system-level integration in industrial environments.

Targeted at applications that demand performance and flexibility, this industrial-grade device combines approximately 47,500 logic elements, around 2.18 Mbits of embedded memory, and 296 user I/Os to support complex control, compute and interface functions while operating across a wide core-voltage range and extended temperature window.

Key Features

  • Logic Capacity  Approximately 47,500 logic elements to implement complex combinational and sequential logic functions.
  • Embedded Memory  Approximately 2.18 Mbits of on-chip RAM (2,184,192 bits) suitable for buffering, FIFOs and local data storage.
  • High-Speed I/O  296 user I/Os in modular banks to support diverse interface standards and mezzanine connections.
  • DSP and Math Resources  Stratix III family DSP features include dedicated multiplier blocks and MAC capabilities for signal processing and algorithm acceleration.
  • Clocks and PLLs  Family-level support for multiple clocking resources including numerous global, regional and peripheral clocks and up to 12 PLLs for clock synthesis and phase control.
  • Selectable Core Voltage  Core supply range from 0.86 V to 1.15 V, enabling trade-offs between performance and power consumption.
  • Package and Mounting  484-BBGA (FCBGA) package, supplier package 484-FBGA (23×23), surface-mount mounting for compact board designs.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • Security and Reliability  Series-level Stratix III features include optional 256-bit AES encryption and configuration memory error detection mechanisms for improved design protection and reliability.
  • Regulatory  RoHS compliant.

Typical Applications

  • High-Performance Signal Processing  Accelerate DSP algorithms, FIR filters and multiply-accumulate workloads using on-chip multiplier/DSP resources and embedded memory.
  • Networking & Communications  Implement protocol engines, packet processing and SERDES-enabled interfaces using abundant I/O and clocking resources.
  • Memory Interface Controllers  Support for complex external memory interfaces and timing-critical buffering using dedicated I/O and memory resources.
  • Industrial Control & Instrumentation  Industrial-grade temperature rating and robust I/O make the device suitable for motor control, motion systems and factory automation controllers.

Unique Advantages

  • Balanced Compute and Memory:  A combination of ~47,500 logic elements and ~2.18 Mbits of embedded RAM enables complex logic alongside local data storage without immediate external memory dependence.
  • Flexible Power/Performance Trade-offs:  Selectable core voltage (0.86 V–1.15 V) allows designers to tune device behavior for performance or lower power operation.
  • Extensive I/O Resources:  296 user I/Os in a modular bank structure support a wide range of interfaces, simplifying system-level integration.
  • Industrial Reliability:  Rated for −40 °C to 100 °C and RoHS compliant, suitable for long-lived industrial deployments.
  • On-chip Security & Error Detection:  Series-level support for AES encryption and configuration memory error detection improves IP protection and system availability.

Why Choose EP3SL50F484I4G?

The EP3SL50F484I4G places Stratix III L family capabilities into a compact 484-FBGA footprint, delivering a practical blend of logic, memory and I/O for demanding embedded and signal-processing applications. Its selectable core voltage, extensive clocking resources and DSP support make it a strong option for designs that require adaptability between performance and power.

Engineers developing industrial equipment, communications hardware, or compute-accelerated modules will find this device suitable for scalable designs that benefit from the Stratix III ecosystem and family-level features for security, clocking and memory interfaces.

Request a quote or submit an inquiry to get pricing and availability for EP3SL50F484I4G.

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