EP3SL50F484I4G
| Part Description |
Stratix® III L Field Programmable Gate Array (FPGA) IC 296 2184192 47500 484-BBGA, FCBGA |
|---|---|
| Quantity | 497 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA, FCBGA | Number of I/O | 296 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1900 | Number of Logic Elements/Cells | 47500 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 2184192 |
Overview of EP3SL50F484I4G – Stratix® III L FPGA, 47,500 Logic Elements, 484-FBGA
The EP3SL50F484I4G is a Stratix® III L Field Programmable Gate Array (FPGA) in a 484-ball FCBGA package designed for high-performance logic, DSP and embedded applications. Built on the Stratix III family architecture, it offers a balance of logic, on-chip memory and high-speed I/O for system-level integration in industrial environments.
Targeted at applications that demand performance and flexibility, this industrial-grade device combines approximately 47,500 logic elements, around 2.18 Mbits of embedded memory, and 296 user I/Os to support complex control, compute and interface functions while operating across a wide core-voltage range and extended temperature window.
Key Features
- Logic Capacity Approximately 47,500 logic elements to implement complex combinational and sequential logic functions.
- Embedded Memory Approximately 2.18 Mbits of on-chip RAM (2,184,192 bits) suitable for buffering, FIFOs and local data storage.
- High-Speed I/O 296 user I/Os in modular banks to support diverse interface standards and mezzanine connections.
- DSP and Math Resources Stratix III family DSP features include dedicated multiplier blocks and MAC capabilities for signal processing and algorithm acceleration.
- Clocks and PLLs Family-level support for multiple clocking resources including numerous global, regional and peripheral clocks and up to 12 PLLs for clock synthesis and phase control.
- Selectable Core Voltage Core supply range from 0.86 V to 1.15 V, enabling trade-offs between performance and power consumption.
- Package and Mounting 484-BBGA (FCBGA) package, supplier package 484-FBGA (23×23), surface-mount mounting for compact board designs.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
- Security and Reliability Series-level Stratix III features include optional 256-bit AES encryption and configuration memory error detection mechanisms for improved design protection and reliability.
- Regulatory RoHS compliant.
Typical Applications
- High-Performance Signal Processing Accelerate DSP algorithms, FIR filters and multiply-accumulate workloads using on-chip multiplier/DSP resources and embedded memory.
- Networking & Communications Implement protocol engines, packet processing and SERDES-enabled interfaces using abundant I/O and clocking resources.
- Memory Interface Controllers Support for complex external memory interfaces and timing-critical buffering using dedicated I/O and memory resources.
- Industrial Control & Instrumentation Industrial-grade temperature rating and robust I/O make the device suitable for motor control, motion systems and factory automation controllers.
Unique Advantages
- Balanced Compute and Memory: A combination of ~47,500 logic elements and ~2.18 Mbits of embedded RAM enables complex logic alongside local data storage without immediate external memory dependence.
- Flexible Power/Performance Trade-offs: Selectable core voltage (0.86 V–1.15 V) allows designers to tune device behavior for performance or lower power operation.
- Extensive I/O Resources: 296 user I/Os in a modular bank structure support a wide range of interfaces, simplifying system-level integration.
- Industrial Reliability: Rated for −40 °C to 100 °C and RoHS compliant, suitable for long-lived industrial deployments.
- On-chip Security & Error Detection: Series-level support for AES encryption and configuration memory error detection improves IP protection and system availability.
Why Choose EP3SL50F484I4G?
The EP3SL50F484I4G places Stratix III L family capabilities into a compact 484-FBGA footprint, delivering a practical blend of logic, memory and I/O for demanding embedded and signal-processing applications. Its selectable core voltage, extensive clocking resources and DSP support make it a strong option for designs that require adaptability between performance and power.
Engineers developing industrial equipment, communications hardware, or compute-accelerated modules will find this device suitable for scalable designs that benefit from the Stratix III ecosystem and family-level features for security, clocking and memory interfaces.
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