EP3SL50F484I4LG

IC FPGA 296 I/O 484FBGA
Part Description

Stratix® III L Field Programmable Gate Array (FPGA) IC 296 2184192 47500 484-BBGA, FCBGA

Quantity 750 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGA, FCBGANumber of I/O296Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1900Number of Logic Elements/Cells47500
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits2184192

Overview of EP3SL50F484I4LG – Stratix® III L FPGA, 47,500 logic elements, 484-BBGA

The EP3SL50F484I4LG is a Stratix® III L field programmable gate array (FPGA) offering a balance of logic, memory, and multiplier resources for mainstream, high-performance embedded and signal-processing applications. Built on the Stratix III family architecture, it combines substantial on-chip logic and memory with selectable core-voltage and programmable power technology to help manage performance and power trade-offs.

With 47,500 logic elements, approximately 2.18 Mbits of embedded memory, and 296 user I/Os in a 484-ball FCBGA package, this industrial-grade surface-mount device targets applications that require dense programmable logic, robust I/O capability, and wide operating conditions.

Key Features

  • Logic Capacity  Provides 47,500 logic elements to implement complex combinational and sequential logic.
  • Embedded Memory  Approximately 2.18 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
  • DSP and Arithmetic Support  Family-level DSP resources support a range of multiplier sizes and multiply-accumulate functions for signal-processing tasks.
  • I/O and High-Speed Interfaces  296 user I/Os arranged in modular banks with support for high-speed differential signaling and SERDES features described for the Stratix III family.
  • Clocking and PLLs  Device family support for multiple global, regional, and peripheral clocks plus up to 12 PLLs enables flexible clock-domain management.
  • Power Management  Selectable core voltage and Programmable Power Technology (family features) enable trade-offs between power consumption and performance within the specified 0.86 V to 1.15 V supply range.
  • Security and Reliability  Family supports optional 256-bit AES configuration encryption and configuration memory integrity features such as CRC and ECC for increased design protection and reliability.
  • Package and Mounting  484-ball BBGA / FCBGA package (supplier device package: 484-FBGA 23×23), surface-mount mounting type for compact board integration.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet demanding environmental requirements.
  • Standards and Compliance  RoHS compliant.

Typical Applications

  • High-performance signal processing  DSP-rich Stratix III family features and the device’s logic and memory resources support FIR filters, FFTs, and real-time processing pipelines.
  • Networking and communications  High-speed differential I/O capabilities and SERDES support make the device suitable for packet processing, line cards, and protocol bridging.
  • Memory controllers and interfaces  On-chip memory and modular I/O banks enable implementation of DDR/DDR2/DDR3 and other external-memory interfaces supported by the Stratix III family.
  • Embedded systems and prototyping  Integrated logic density, memory, and family-level support for the Nios® II embedded processor and megafunctions facilitate system-on-chip prototyping and custom embedded designs.

Unique Advantages

  • Balanced resource mix: 47,500 logic elements with substantial embedded memory enable both control and data-path functions within a single device, reducing external components.
  • Configurable power/performance: Selectable core voltage and Programmable Power Technology allow designers to tune power and performance to application needs within the 0.86–1.15 V supply window.
  • Robust I/O flexibility: 296 I/Os in modular banks provide flexible signaling options and support for a wide range of interface standards described for the Stratix III family.
  • Industrial operating range: −40 °C to 100 °C rating supports deployment in temperature-demanding environments.
  • Security and integrity features: Family-level AES configuration encryption, CRC, and ECC options help protect configuration data and improve system availability.
  • Compact, surface-mount package: 484-ball FCBGA package (23×23) balances board-area efficiency with I/O density for space-constrained designs.

Why Choose EP3SL50F484I4LG?

The EP3SL50F484I4LG positions itself for mainstream high-performance and embedded applications that require a balanced mix of logic, on-chip memory, and flexible I/O. Its Stratix III L family attributes—configurable power, DSP support, family-level security and reliability features—make it suitable for designers who need a programmable alternative to fixed-function ASICs while retaining control over power and performance trade-offs.

This industrial-grade, surface-mount FPGA is well suited for customers developing signal-processing, communications, memory-interface, and embedded systems who value programmability, integration, and long-term design scalability backed by the Stratix III device family capabilities.

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