EP3SL50F484I4LG
| Part Description |
Stratix® III L Field Programmable Gate Array (FPGA) IC 296 2184192 47500 484-BBGA, FCBGA |
|---|---|
| Quantity | 750 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA, FCBGA | Number of I/O | 296 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1900 | Number of Logic Elements/Cells | 47500 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 2184192 |
Overview of EP3SL50F484I4LG – Stratix® III L FPGA, 47,500 logic elements, 484-BBGA
The EP3SL50F484I4LG is a Stratix® III L field programmable gate array (FPGA) offering a balance of logic, memory, and multiplier resources for mainstream, high-performance embedded and signal-processing applications. Built on the Stratix III family architecture, it combines substantial on-chip logic and memory with selectable core-voltage and programmable power technology to help manage performance and power trade-offs.
With 47,500 logic elements, approximately 2.18 Mbits of embedded memory, and 296 user I/Os in a 484-ball FCBGA package, this industrial-grade surface-mount device targets applications that require dense programmable logic, robust I/O capability, and wide operating conditions.
Key Features
- Logic Capacity Provides 47,500 logic elements to implement complex combinational and sequential logic.
- Embedded Memory Approximately 2.18 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
- DSP and Arithmetic Support Family-level DSP resources support a range of multiplier sizes and multiply-accumulate functions for signal-processing tasks.
- I/O and High-Speed Interfaces 296 user I/Os arranged in modular banks with support for high-speed differential signaling and SERDES features described for the Stratix III family.
- Clocking and PLLs Device family support for multiple global, regional, and peripheral clocks plus up to 12 PLLs enables flexible clock-domain management.
- Power Management Selectable core voltage and Programmable Power Technology (family features) enable trade-offs between power consumption and performance within the specified 0.86 V to 1.15 V supply range.
- Security and Reliability Family supports optional 256-bit AES configuration encryption and configuration memory integrity features such as CRC and ECC for increased design protection and reliability.
- Package and Mounting 484-ball BBGA / FCBGA package (supplier device package: 484-FBGA 23×23), surface-mount mounting type for compact board integration.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet demanding environmental requirements.
- Standards and Compliance RoHS compliant.
Typical Applications
- High-performance signal processing DSP-rich Stratix III family features and the device’s logic and memory resources support FIR filters, FFTs, and real-time processing pipelines.
- Networking and communications High-speed differential I/O capabilities and SERDES support make the device suitable for packet processing, line cards, and protocol bridging.
- Memory controllers and interfaces On-chip memory and modular I/O banks enable implementation of DDR/DDR2/DDR3 and other external-memory interfaces supported by the Stratix III family.
- Embedded systems and prototyping Integrated logic density, memory, and family-level support for the Nios® II embedded processor and megafunctions facilitate system-on-chip prototyping and custom embedded designs.
Unique Advantages
- Balanced resource mix: 47,500 logic elements with substantial embedded memory enable both control and data-path functions within a single device, reducing external components.
- Configurable power/performance: Selectable core voltage and Programmable Power Technology allow designers to tune power and performance to application needs within the 0.86–1.15 V supply window.
- Robust I/O flexibility: 296 I/Os in modular banks provide flexible signaling options and support for a wide range of interface standards described for the Stratix III family.
- Industrial operating range: −40 °C to 100 °C rating supports deployment in temperature-demanding environments.
- Security and integrity features: Family-level AES configuration encryption, CRC, and ECC options help protect configuration data and improve system availability.
- Compact, surface-mount package: 484-ball FCBGA package (23×23) balances board-area efficiency with I/O density for space-constrained designs.
Why Choose EP3SL50F484I4LG?
The EP3SL50F484I4LG positions itself for mainstream high-performance and embedded applications that require a balanced mix of logic, on-chip memory, and flexible I/O. Its Stratix III L family attributes—configurable power, DSP support, family-level security and reliability features—make it suitable for designers who need a programmable alternative to fixed-function ASICs while retaining control over power and performance trade-offs.
This industrial-grade, surface-mount FPGA is well suited for customers developing signal-processing, communications, memory-interface, and embedded systems who value programmability, integration, and long-term design scalability backed by the Stratix III device family capabilities.
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